AI Technology

AI Technology, Inc. has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. has been one of the leading forces in development of patented applications of advanced material and adhesive solutions for electronic interconnection and packaging. The company continues to provide adhesive solutions for component and substrate bonding for both military and commercial applications. It’s thermal interface material solutions of patented phase-change thermal pads, thermal grease and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductor and modules, computer and communication electronics.


Alpha Novatech

Alpha Novatech, Inc. is your partner for Thermal Solutions.

We offer a wide variety of standard heat sinks and accessories. Our product line includes natural convection, forced convection, and active heat sinks. We also offer various attachment methods and hardware for almost any application. In addition, we can offer free heat sink thermal simulations. Standard or custom heat sinks in prototype to production quantities Quick and easy customization without NRE fees, while featuring short lead times Standard parts are carried in stock Lead time for custom parts of 1-2 weeks is possible for initial quantities.


Analysis Tech

Semiconductor Thermal Testers: Complete measurement systems for device thermal resistance, impedance, & die-attach quality using transient & steady state electrical-junction temperature-measurement.   Transient structure function analysis is used to delineate internal-package resistances & measure Rjc via JEDEC 51-14.   Power Cycling systems for device life-testing with automatic monitoring of thermal deterioration with age.  Test services offered.

Thermal Interface Material Testers: ASTM D5470 based testers offering fast & accurate measurement of thermal conductivity & contact resistance of electronic-packaging materials over a wide range of thickness, pressure, & temperature.  Test services offered.

Event Detectors: Electrical reliability-testers for passive interconnects including solder joints & connectors, with easy integration to thermal-cycle, drop-test, shock, and vibration gear; based on JEDEC and IPC standards for interconnect reliability testing



ANSYS is the leading provider of electronic cooling, electromagnetic field, circuit and system simulation software for the design of high-performance electronic equipment. Companies throughout the world rely on ANSYS software to solve thermal integrity, mechanical reliability, signal integrity, power integrity and EMI challenges in IC, package and PCB and perform power optimization in custom IC’s. Ansys develops open and flexible simulation solutions that enable users to simulate design performance directly on the desktop, providing a common platform for fast, efficient and cost-effective product development, from design concept to final-stage testing and performance validation. Engineers rely on ANSYS to achieve first-pass system success when designing mobile communication devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs) and electromechanical systems. ANSYS’ unique multiphysics platform provides a highly-accurate design flow for fast, efficient and simulation driven product development.


Cadence Design Systems, Inc

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at



CEJN North America

CEJN North America, the Quick Connect Solution Provider, delivers couplings and solutions for your liquid cooling needs. Our Leak-Free, Non-Drip coupling series offers high flow and minimal pressure drop; and Blind Mating options range from DN 3 to DN 19. CEJN’s new UltraFlow Series features an extremely high flow combined with an unequalled low pressure drop. Customized solutions are also available. At CEJN, we develop our products for a future in liquid cooled data centers. Contact us: PHONE: 847-263-7200, by email:, or via


Celsia Inc.

Celsia specializes in custom heat sink design and manufacturing using liquid two-phase devices: heat pipes and vapor chambers. Through its US headquarters and Taiwan design & production facility, the company’s goal is to deliver fast, affordable, and reliable thermal solutions for the most demanding applications including high density electronics, performance CPU / GPU, amplifiers, HBLEDs, ASICS, and rugged systems.  In recent years, Celsia has shipped over 2.5 million thermal assemblies to a global custom base in the telecommunications, computer, test equipment, defense, laser, and medical markets.


CFturbo GmbH

The German based company CFturbo GmbH offers sophisticated software and engineering solutions for conceptual design of Turbomachinery components like impellers, vaned and vaneless stators and volutes or complete Turbomachinery stages. CFturbo® software can be used to design axial, radial and mixed-flow pumps, blowers, compressors and turbines, as well as for diffusers, stators, return channels and volutes. Recently new developed modules to create axial fans, axial turbines, axial pumps and inducers allow the design of a greater variety of Turbomachinery models then before. Additionally, the company offers a wide range of consulting and engineering services for Turbomachinery applications including design, simulation, optimization and prototyping. Experimental investigation on Turbomachinery can be provided with experienced partners.



Chilldyne sells liquid cooling systems optimized for data centers. Our direct-to-chip liquid cooling Cool-Flo® system offers all the benefits of liquid cooling without reducing uptime and with no worries about leaks.  The system utilizes hybrid air-and-liquid-cooled heat sinks and negative pressure to deliver a zero-downtime, leak-proof, low-cost solution.  Our system is optimized for ease of installation and operation so that all the rack and server level connections do not require a plumber. The system installs into most servers and racks with no modifications making the switch to modern liquid cooling an easy decision.



At COFAN USA, we keep your hot technology cool. COFAN USA is an industry leading manufacturer in thermal management solutions with inhouse thermal engineering team providing thermal simulation service and consultation to our customers. With more than 20 years of expertise, we’ve had the pleasure of serving a diverse customer base in many industries. We offer quick turnaround product inquiries and prototyping services. We pride ourselves in giving the best possible customer service, the highest quality products with the shortest lead time, and competitive pricing in the industry. To learn more about us, please visit


CoolIT Systems

CoolIT Systems specializes in scalable liquid cooling solutions for individual servers through to the world’s largest data centers. Through its modular, rack-based Direct Contact Liquid Cooling technology, Rack DCLC™, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. From cold plates specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD, through to manifolds and heat exchangers, CoolIT’s reliable technology installs into any server or rack, ensuring ease of adoption and maintenance.



CPC thinks beyond the point of connection to help protect valuable electronics. Designed specifically for liquid cooling applications, rugged couplings withstand long periods of connection yet disconnect reliably without drips.



DegreeC engineers airflow and delivers solutions. We make airflow sensors, instruments for measuring airflow, and custom-designed intelligent systems that deliver precise flows of air exactly where it’s needed. We do this at chip scale, board level, box scale, room scale and for entire buildings. Our largest application is intelligent cooling systems to address the heat generated by densely packed electronics for a variety of industries…but we also offer airflow-based solutions for non-thermal applications – where precise measurement and control of the quantity and/or direction of airflow is critical.


Delta Products Corporation

The Delta Fan and Thermal Products Group designs and builds innovative cooling systems that perform at the highest levels – even in the harshest environments.

The Delta Fan and Thermal product line offers a full range of axial fans, blowers, heat pipes, vapor chambers and liquid cooler products.

The unique patented design and innovative structure greatly increases cooling performance and reduces system noise. Delta fans and thermal products can be found worldwide, serving a wide range of industries and organizations. Highly efficient cooling solutions can be customized to fit the needs of virtually any business


Eisele Connectors Inc.

Eisele Connectors, Inc. manufactures a complete line of robust all-metal push-in fittings, acid-resistant and corrosion-free stainless-steel components, multiple-media connectors and plastic tubing used in Automation, Food, Pharma, Medical, Robotics, Automotive, and Packaging industries. We also provide technical support and specialize in providing custom leak-free connection solutions for applications where others simply don’t. Our sales office and warehouse are located in Grand Rapids, Michigan to provide quick shipping and technical support to our growing customer base in North America. All of our products are 100% made in Germany.


Electronics Cooling

Electronics Cooling®

Electronics Cooling® magazine has been providing practical education in the field of thermal management of electronics since 1997. We cover the most common thermal management solutions including materials, techniques, components and devices, and their associated thermal properties used in electronics packaging. Electronics Cooling® is published by ITEM Media.


Element Six Technologies

Element Six fabricates and sells engineered synthetic poly- and single crystal diamond products and diamond composites. Technologies using CVD Diamond material include thermal management for component such as laser diodes, laser diode arrays, power devices, RF amplifiers, RF resistors, LED’s and others. We also manufacture high power laser optics, beam splitters, IR spectroscopy, high energy particle detectors as well as electrochemistry and products for scientific applications. In order to address the ever increasing requirements in the semiconductor industry, an extreme material like diamond makes its way into applications where it was not considered previously. Through its high thermal conductivity, extreme stiffness, low density and abrasion resistance it is becoming the material of choice for demanding applications such as wafer carriers, heating components, scanner mirrors and laser shutters.


ESI Group

ESI Group – Leading Innovator in Virtual Prototyping Software and Services. Specialist in material physics established in more than 40 countries, ESI has developed a unique proficiency in helping industrial manufacturers replace physical prototypes by virtually replicating the fabrication, assembly and testing of products in different environments.

ESI offers solutions for simple physics to complex coupled physics. ESI-PRESTO is a complete CFD analysis solution for the thermal management in the electronics industry that will help in the design of high-performance components and systems at the lowest cost.



Exatron is an American made provider of low to high volume, fully integrated automation for programming, IoT, MEMS, test & mark applications. We start with pick & place, inline, rotary, or gravity feed transport mechanisms. Pick any combination of input and output, JEDEC tray, tape & reel, tube, boat, stack, or bowl feed. We interface to any OEM or in-house programmer. We build in laser markers, labelers, and ink jet printers. Add on top/bottom inspection, OCR, 1D/2D bar code vision. Tie this all together with Exatron generated Windows GUI. Building beyond your expectations since 1974.


Fujipoly America

Fujipoly is a world leader in the manufacture of Sarcon® Thermal Interface Materials, which are used to help keep sensitive electronic components cool by eliminating the air gap between the component and heat sink. Our products range in thermal conductivity from 1.0m watt/m-K to 17 watt/m-K, offering some of the lowest thermal resistance in the industry. Our product line-up consists of soft Gap Filler Pads, Conformable Putties, Form-In-Place Gap Fill Materials, as well as custom and standard die-cut thin film materials. Our wide range of material types, coupled with the widest range of thermal conductivity, allows us to meet most design criteria. Fujipoly has nine locations in North America, Europe, and Asia making it easy for us to assist our customers at the local level.


Future Faciltities

We set Future Facilities up to deliver the power of engineering simulation into the hands of an emerging data center industry. We created a tool optimized for data centers, designed to be used by the DC professional, and made it powerful, intelligent, automated and connected. Five years later, we tuned our technology to deliver the same benefits to the thermal management of electronics and provide an integrated toolset for these two converging industries. We develop engineering simulation software that allows our customers to quantify and qualify business decisions balancing risk against cost. Our offering covers the full spectrum starting from electronics design to data center design and operations. Our software provides a safe, offline environment in which to create virtual prototypes, troubleshoot existing designs and run what-if scenarios for future configurations.


H C Stark

As a global leader in technology metals, H.C. Starck manufactures thermal management components from W and MoCu composites, CuMoCu laminates, plated Mo and W flat products for demanding applications in aerospace, military, high speed trains and automotive industries. The reliability and efficiency of semiconductor devices and electronic packaging are optimized through maximization of the thermal conductivity of heat dissipating components. H.C. Starck provides enhanced thermal conductivity and unique capabilities to tailor excessive heat dissipation hot spots by minimizing thermal resistance through optimization of CTE between the device and thermal component using our low CTE robust refractory metal and composite products.


Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit or email You can also follow our experts, From One Engineer To Another® (#FOETA), at or @IndiumCorp.



Jones Tech

Jones Tech provides creative thermal and EMI solutions to improve the reliability of electronic equipment. Established in 1997, with its rich R&D resources and manufacturing experience, Jones Tech has been serving consumer electronics, telecommunications, IT, medical, and renewable energy customers. We are a long-term supplier to 4 of the top 5 Silicon Valley companies. Our thermal interface material (TIM) includes thermal pads, gel, grease, thermal phase change materials (PCM), and graphite TIM. For heat spreaders, we are a leading supplier of synthetic and natural graphite. We have in-house rotary and flatbed die-cutting capabilities. For heat storage materials, we offer PCM pads, gel and potting material. We can help with manual or robotic dispensing. Additionally, we help solve problems with EMI and RF related components.



KULR’s proprietary carbon fiber-based architecture replaces less efficient aluminum and copper based heat spreaders and exchangers, which are energy intensive and less environmentally friendly to produce. Carbon fiber thermal interface materials are superior alternatives to particle based thermal interface materials for higher performance, lower contact pressure, higher compliance, and longer reliability.



LISAT, manufacturer of Thermal Interface Material & EMI products. HQ in U.S., LISAT have operations in Asia. In U.S., we provide Thermal Management Solution to customers & work with R&D Engineers at Design Centres. We provide technical support & samples to our customers to test our materials. Our Asia operations provide manufacturing, converting, technical & sales to customers’ worldwide. Our products : TIM Pad, Insulator, Silicon Free TIM, Gel, Grease, Mylar, Graphite, Conductive Plastic, Conductive Elastomer, Fabric-Over-Foam, Microwave Absorbing Material, Metal Finger Stock, EMI Shielding Solution, Switching Power Supply, Desktop & Wall Mount Adaptor, Metal Core PCB, Ceramic PCB. Email


Long Win

Since 1985, Long Win specializes in research, design, manufacture and service of scientific instruments and apparatus for thermal management, material & fluid mechanics and educational fields. Long Win holds a leading position on research, measurement and inspection apparatus for the electronic cooling industry. Some of their product lines include thermal-related measurement apparatus for fan performance (automated airflow benches based on AMCA 210 standard), TIMs (Thermal resistance and conductivity measurement), cooler modules, heat pipes, vapor chambers, IC packages, LEDs, and natural-convection simulation. They have more than 100 types of apparatus in their 18,000 sq. ft. lab which is located in Taiwan. Long Win’s thermal is launched in Livermore California later in 2016. Website:




As a leader in electronic liquid cooling system, Man Zai offers a wide range of thermal modules for CPU, VGA, LED, Bio-Chemical and automotive electronic device. The thermal team is equipped with state of the art hardware and software, which includes wind tunnel testing, hydraulic test equipment, simulation software, helium & air leakage test equipment and ultra-high-speed pre-filling technology. We are able to establish long-term relationships with several world-wide famous brand names. The quality system and sophisticated R&D capability in Man Zai will provide our customers the best thermal solution.



Materion Advanced Materials is an industry leader in providing durable and best-cost solutions for ceramic packages and hermetic cover/lids for the microelectronics industry.  We offer a comprehensive portfolio of packaging materials in precious or non-precious material and can customize innovative electronic package materials to satisfy your unique needs.  Our high-reliability packaging also supports most configurations, applications and volume requirements. Because of our industry expertise, extensive global manufacturing capabilities and R&D proficiency, we are able to meet customers’ packaging requirements today and partner with them to meet future challenges.


Mentor Graphics Corporation – Mechanical Analysis

Mentor Graphics – Mechanical Analysis provides leading electronics cooling software, FloTHERM® & FloTHERM® XT, and MicReD® thermal measurement test solutions to support faster development of reliable products.

Learn about compressing the thermal design process via seamless handling of complex CAD geometry and detailed PCB data allowing earlier, robust simulation.  Hot topics include improved rotating geometry modeling (Fans), design of experiments, New SmartPart capabilities, automatic package model calibration, more …..

Semiconductor Thermal Characterization (incl. Rth ), Failure Diagnosis and Manufacturing Defect Identification – MicReD® T3STer® thermal transient test technology provides accurate, fast, repeatable measurement (JEDEC JESD51-14 compliant). Learn about using Structure Functions, Rth-Cth profiles of the heat flow path from junction to ambient, and automatic IC package model calibration using FloTHERM.  Solutions include TeraLED® for LED lighting thermal/radiometric characterization, DynTIM™ for Thermal Interface Materials and the Power Tester™ range for power semiconductor reliability and lifetime prediction (e.g IGBTs), combining active power cycling and thermal degradation identification.


MSC Software

Software Cradle is a leading provider of Computational Fluid Dynamics (CFD) software including SC/Tetra (general purpose unstructured mesh), scSTREAM (general purpose Cartesian mesh), and HeatDesigner (Cartesian mesh for electronics). Since inception in 1984, Cradle has established itself as a major innovator that is advancing the role of simulation in engineering design. Our software products are well known for ease of use, exceptionally fast and powerful meshing, efficient solvers, sophisticated physical models, and professional post processing. In 2016, Software Cradle has joined MSC Software Corporation, the worldwide leader in the field of multidiscipline simulation.

NeoGraf Solutions

NeoGraf Solutions, LLC is a company with a rich history that stretches back over 135 years. With a strong culture of innovation and development, NeoGraf offers the largest portfolio of flexible graphite thermal management solutions. NeoGraf offers solutions for a variety of markets ranging from Thermal Interface materials for Computing and Power Electronics to heat spreaders for the most demanding of smartphones.

6 R&D 100 awards over the past 15 years, including eGRAF® HITHERM™ Thermal Interface Material, eGRAF® SPREADERSHIELD™ heat spreaders, both Natural and Synthetic Graphite, and the 1st compressible graphite TIM, is a testimony to the long history of technical innovation.



Package Science Service

We are IC packaging experts. Decades of experience support development of standard and custom high performance IC packages that precisely match the performance of your chip or device on time and within your budget. Our engineering teams provide package selection, design, layout, prototype, and production solutions. Design, modeling and simulation tools are used for signal and power integrity, thermal/mechanical, and manufacturing process simulation and analysis. To close the loop, thermal and electrical test labs provide in-house validation and testing services. Located in Santa Clara, CA. Contact us and come by for a tour of our labs and discuss how we can help you solve your IC packaging challenges.


QuantaCool Corporation

Highly efficient, environmentally friendly, reliable passive two-phase cooling systems for data centers and high-performance computers. QuantaCool Corporation has developed and patented two-phase cooling systems that use highly efficient proprietary cold plates to remove heat without pumps or water. Waste heat to be moved to remote locations with greater reliability. QCC’s technology improves heat management and enables energy recovery possibilities. QuantaCool has introduced both PolarRak™ and PolarBox™ systems to serve the Data Center and High Performance computing segments.

The QCC PolarRack™ System, requires less initial capital, increases data center capacity, and reduces total energy costs by up to 80%. QCC’s PolarBox™ is intended for use by gamers and bit coin miners who require intensive computing power.


Schlegel Electronic Materials

Schlegel introducing our OpTIM-Thermal Interface Materials & BandSorbtm Absorbers

OpTIM products are a line of thermal interface materials that offer a wide range of thermal performance and physical properties and can resolve even the most challenging thermal problems.

Our TIMs have already been used in various electronic equipment’s /components including advanced micro-processors, high speed memory modules, micro heat pipe assemblies and LED Lightning.

Our new BandSorbtm SC product line will help to suppress unwanted EMI/RFI energy. BandSorbtm SC series is suitable for most commercial, telecommunication, automotive, military and medical applications. The high magnetic loss of the BandSorbtm SC series is designed to exhibit high loss and is intended to be applied to metal surfaces. When placed on the inside of a microwave cavities BandSorbtm SC series will reduce the Q of the cavity, eliminate surface currents and generally dampen reflections.


Schunk Carbon Technology

Schunk Carbon Technology is a world leader in the development and production of carbon and graphite materials and components for the automotive and railway industries. Additionally, we provide two graphite-based solutions for the electronics cooling industry. The composite material, Aluminium Graphite (ALG), combines the low coefficient of thermal expansion and density of graphite with the excellent thermal properties of aluminium to create an ideal thermal management material for high-reliability applications. With its ready machinability, we can produce customized ALG parts in various quantities with a range of platings. We will premier our innovative phase change material (PCM) which is a novel approach to latent heat storage units. The nature of the PCM is such that it is self-encapsulating requiring no additional casing. Its expand-to-shape production process allows for custom designs at an attractive cost with optimal thermal properties.


Shin-Etsu MicroSi

Shin-Etsu MicroSi is the leader in Thermal Interface Material, we have also developed an extensive line of Molding Compounds, Encapsulants, Silicon and Epoxy coatings along with die Attachment Materials. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications. Some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads.


Solid State

Solid State Technology

Solid State Technology is part of the Semiconductor Manufacturing and Design Network which includes the SemiMD portal, Solid State Technology reaches the largest, most qualified community of decision makers for semiconductor and electronics manufacturing through the magazine, email newsletters, website, webcasts and The ConFab Conference & Networking event which will be held at The Hotel del Coronado in San Diego May 14th – 17th, 2017. Topics covered include Advanced Packaging, MEMS, LEDs, Displays, and Materials as well as current trends in the industry. Visit us here


Staubli Booth

Stäubli is an innovative mechatronics solutions provider offering non-spill, clean break quick-release couplings perfect for use in thermal management and ensure reliability over long periods of time.  Their compact design means that they can be incorporated seamlessly into any installation. With a variety of coupling material options and numerous seal types available, they are compatible with a wide range of coolants and temperatures. Built-in misalignment compensation on several styles makes Stäubli couplings perfect for blind mate rack connections.


t-Global Technology

t-Global Technology is a leading supplier of advanced thermal management solutions. We design, develop and manufacture our own range of interface materials based on the stringent needs of our key markets. From our European and Asian locations, we offer design support, rapid sampling and full engineering support.

It is this corporate philosophy that has fuelled our growth and allowed our customers to come to market with technologically appropriate products. Our continued links with key customers, academic institutions and industrial decision makers will feed t-Global Technology’s development so that we remain your number one choice for all your thermal management needs.


TennMax America, Inc.

TennMax is a leader in EMI shielding and Thermal Management. Our primary focus is to provide a complete solution utilizing our advanced knowledge in conductive silicones,gasketing, plastic metallization, heat pipe assemblies and phase change materials.

TennMax offers both Silicone and Non-Silicone thermal interface materials, which can be provided as a pad or dispensible gel form.  We also have full thermal design and manufacturing services targeted towards full custom thermal assemblies.



Thermal Engineering Associates

TEA is a company founded by Bernie Siegal, a 35+-year veteran and recognized technical leader in the semiconductor thermal field. The company’s mission is to provide a central source for the products and services necessary for proper semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related measurement, modeling and/or management requirements.


Tran-Tec LLC

Since 1971 Tran-Tec has been supplying the electronics industry with thermal solutions.  From prototype through production we offer a library of over 200 extrusion profiles, dozens of bonded fin options, liquid cooled chill plates, and 47 years of experience.  Tran-Tec offers full CNC Machining, class II anodizing and finishing as a one-stop shop for your heat sink needs.

Wacker Chemical Corp.

WACKER is a global silicone leader with a broad portfolio of ‎products designed for the needs of the electronics industry.  Our SEMICOSIL®, SilGel®, and ELASTOSIL® brands are globally recognized in the industry.  Please stop by our booth and learn how our potting gels, adhesives, and newest thermal interface materials can help you meet your design challenges.