39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium
March 13–17, 2023

At the DoubleTree by Hilton San Jose
2050 Gateway Place, San Jose, CA 95110, US, Tel 855-610-8733


SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. Its goals are to:

  • Provide knowledge covering all thermal length scales from integrated circuits to facility levels
  • Foster discussions between thermal engineers, professionals and industry experts
  • Encourage the exchange of information on academic and industrial advances in electronics cooling

Topics Include: Component/Board/System Thermal Design, Fluid Movers, Two-Phase Cooling, Acoustics, Advanced Materials, Measurement Methods, Modeling & Simulation, Additive Manufacturing, Reliability, etc.

Applications Include: Processors/ICs/Memory, 3-D packaging, Computing Systems, Data Centers, Portable/Consumer/Wearable Electronics, Power Electronics, Harsh Environments, Defense/Aerospace Systems, Automotive Systems; Solid-State Lighting & Cooling, Biomedical; Micro/Nano-scale Devices, etc.

Symposium Highlights

Technical Sessions

Technical Short Courses


Vendor Exhibits

Vendor Workshops

Product Tear Downs

Panel Discussions

Poster / Dialog Session


Four options for participating in the technical program:

  • Peer-reviewed paper: Submit a full manuscript for peer review. Authors notified of acceptance in November. Final manuscript due in January. Manuscripts will be provided to conference attendees.
  • Non-peer-reviewed paper: Submit an extended abstract (2-5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final manuscript due in January. Manuscripts will be provided to conference attendees.
  • Presentation only: Submit an extended abstract. Authors notified of acceptance in November. Final presentation slides are due in March. Presentations will be provided to conference attendees.
  • Poster: Submit an extended abstract to share your work with symposium participants at a dialog session during the symposium. Authors notified of acceptance in November. Poster authors may choose to submit a manuscript in January. Final poster due in March.

Awards: All papers with manuscripts, which will be available through IEEExplore, are eligible for the Best Paper Award. Student papers presented at the conference are eligible for Student Scholarships. Presentation-only submissions are not eligible for awards.

Manuscripts and extended abstracts submission deadline Date that authors are notified of acceptance Photo-ready full manuscript submission due date
September 15, 2022 November 18, 2022 January 13, 2023

Upload your paper electronically in RTF, DOC or PDF formats at

For further information please contact the Program Chair
Alex Ockfen, Thermal Engineer, Meta, E-mail:

** All authors qualify for reduced symposium rates **