SEMI-THERM 36, initially scheduled on March 16 through March 20, 2020 has been canceled.
As the issue with the coronavirus continued to grow, many of our attendees, speakers, and exhibitors found themselves unable to attend due to company and government restrictions on travel. Ultimately, the increases in cases in the San Jose region, the recommendation by Santa Clara County that all large group events be postponed, and the declaration of a State of Emergency by the State of California convinced us that the only responsible course of action was to suspend the event for this year.
We will provide further information as it becomes available.
If you have any specific questions, please e-mail us at firstname.lastname@example.org.
6 x four hour short courses from thermal thought leaders
Thermal conference with 50+ technical papers & how-to’s from leading companies and universities
Numerous FREE tear down sessions and product workshops for all attendees
40+ companies set up to show off their capabilities
Technical sales engineers who are ready to introduce and demonstrate new technology in our exhibition hall.
Booth size of 10 x 8 ft. Interact with – and gain – new customers and clients
Over 400 engineers, academicians & industry pundits from 20 countries
150+ companies, consultants and universities represented
FREE admission to all for exhibits, vendor workshops, how-to courses, and products tear downs
“I’ve been involved with SEMI-THERM for over 10 years now. It is one of the best events to connect with colleagues, meet new friends and to learn from industry veterans.”
George Meyer, CEO, Celsia Inc.
Total Activity Time
Who Should Attend
Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services. Here are some of the topics we’ve covered in past years:
- Advances in Thermal Components
- Energy Harvesting Materials
- Thermal Control Methods
- 3D & Nano-Technologies
Component & System Design
- Heat Spreaders, Air Movers, TIMs
- Design Software & Modeling
- Processors, ICs, Memory
- Solid State Technologies
Testing & Validation
- Characterization & Material Measurement
- Instrumentation & Controls
- Reliability Testing
- JEDEC Standards
- Portable & Power Electronics
- Harsh Environments
- Data Centers
|1||LED||Jim Petroski, Design by Analysis|
|2||Two-Phase Cooling||George Meyer and Sobo Sun, Celsia Inc.|
|3||Thermal Interface Materials||Jason Strader, Laird|
|4||Automotive / Aerospace / Outdoor||Bradley Richard, Advanced Cooling|
|5||Measurement Techniques||Hussam Kabbani, Facebook|
|6||CFD / Numerical Modeling||Taravat Khadivi, Qualcomm|
|7||Two-Phase Cooling||Pritish Parida, IBM|
|8||Consumer Electronics||Mark Carbone, Intel and Angel Han, Huawei|
|9||Data Center Cooling||Marcelo del Valle, Intel|