SEMI-THERM® Thermal Technologies Workshop
November 8–10, 2022

Microsoft Corporation Conference Center
Redmond, Washington USA
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Abstracts for presentations may be submitted to:
Dave Saums, DS&A LLC, General Chair • Email:
Vadim Gektin, Qualcomm Technologies, Program Chair • Email:



  • Market drivers: Understanding thermal challenges and business / economic drivers that influence change in electronic systems design and manufacturing – and how these impact thermal design requirements. Developing market trends, market segmentation, cost drivers and reliability factors are examples of topics that set the framework for where and what types of new technical solutions are viable.
  • Stacked-die packaging: Advanced packaging technologies, such as System-In-Package, Multi-chip modules, Multi-package modules, and stacked-die packaging provide significant opportunities for miniaturization and performance enhancements. These technologies introduce significant thermal and interconnect challenges that must be balanced against those benefits and require continuing new developments in materials and solutions.
  • Mobile and handheld devices: Wearables, mobile, medical devices, small displays, tablets, and notebooks introduce unique component- and system- level thermal challenges that require novel design approaches and materials.
  • Wireless and telecom infrastructure: High performance telecom hardware have challenging component and system level requirements that require technical advances to meet the evolving needs for routers, networked systems, and base stations.
  • Power semiconductor thermal components, systems, and solutions: Developments in IGBT thermal management and packaging strongly influence advances in electronic and electrical drive systems, especially important in the EV/HEV and renewable energy markets.
  • Mil/Aerospace: Avionics, RF, energy, and microwave components and modules for phased array radar, countermeasures, communications, and other systems, requiring advanced thermal management as well as high-temperature materials and packaging.
  • System-level cooling: The thermal design of complex systems, such as high-performance computing systems, relies on extensive component- and system-level thermal management analysis to address the broad spectrum of issues that entail a comprehensive system design.
  • Data center cooling: Data center cooling includes a variety of design optimization activities including cooling provisioning, airflow control, temperature distribution and migration paths that range from forced air convection to system liquid cooling.
  • Liquid cooling, phase-change, and refrigeration: Advanced cooling methods that use liquid, latent heat and/or active cooling provide opportunities for enhanced performance and design flexibility. Effective designs must balance advantages and life-cycle cost, reliability and serviceability impact.
  • Thermal interface materials (TIMs) and testing: Advanced thermal interface materials that may include organic, metallic, graphitic materials in bulk form as well as nanoscale are enabling significant advances in the thermal management of high-performance processors, memory, telecom, IGBT, RF, and microwave components and systems. Effective testing is critical in determining the suitability of a TIM for a given application.
  • CTE-matching and high thermal conductivity materials: Metallic, ceramic, and composite materials have been engineered to exhibit excellent thermal conductivity with controlled coefficient of thermal expansion (CTE) properties to allow for better matching with GaN, SiC, silicon, or ceramic materials to reduce thermal stresses in component packaging.

Preparation of Abstract

Speakers should submit one copy of a two-paragraph abstract that describes their proposed 25-minute presentation no later than September 16, 2022. NOTE: No formal technical manuscript is required. A post-conference download that includes presentation materials, as provided by the authors, will be sent to all attendees approximately 15 business days after the event. The speaker’s presentation file must be provided during the workshop.

Abstracts may be submitted to the general and program chairs. An abstract submittal page will also be available at a later date on the Semi-Therm Educational Foundation website ( Accepted presentations may be considered for subsequent publication with a full manuscript in the annual Semi-Therm Symposium and on the Semi-Therm archived website.

TTW 2022 Sponsors

39th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium
March 13–17, 2023

At the DoubleTree by Hilton San Jose
2050 Gateway Place, San Jose, CA 95110, US, Tel 855-610-8733
Submit Paper
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SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. Its goals are to:

  • Provide knowledge covering all thermal length scales from integrated circuits to facility levels
  • Foster discussions between thermal engineers, professionals and industry experts
  • Encourage the exchange of information on academic and industrial advances in electronics cooling

Topics Include: Component/Board/System Thermal Design, Fluid Movers, Two-Phase Cooling, Acoustics, Advanced Materials, Measurement Methods, Modeling & Simulation, Additive Manufacturing, Reliability, etc.

Applications Include: Processors/ICs/Memory, 3-D packaging, Computing Systems, Data Centers, Portable/Consumer/Wearable Electronics, Power Electronics, Harsh Environments, Defense/Aerospace Systems, Automotive Systems; Solid-State Lighting & Cooling, Biomedical; Micro/Nano-scale Devices, etc.

Symposium Highlights

  • Technical Sessions
  • Technical Short Courses
  • Tutorials
  • Vendor Exhibits
  • Vendor Workshops
  • Product Tear Downs
  • Panel Discussions
  • Poster / Dialog Session

Four options for participating in the technical program:

  • Peer-reviewed paper: Submit a full manuscript for peer review. Authors notified of acceptance in November. Final manuscript due in January. Manuscripts will be provided to conference attendees.
  • Non-peer-reviewed paper: Submit an extended abstract (2-5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final manuscript due in January. Manuscripts will be provided to conference attendees.
  • Presentation only: Submit an extended abstract. Authors notified of acceptance in November. Final presentation slides are due in March. Presentations will be provided to conference attendees.
  • Poster: Submit an extended abstract to share your work with symposium participants at a dialog session during the symposium. Authors notified of acceptance in November. Poster authors may choose to submit a manuscript in January. Final poster due in March.

Awards: All papers with manuscripts, which will be available through IEEExplore, are eligible for the Best Paper Award. Student papers presented at the conference are eligible for Student Scholarships. Presentation-only submissions are not eligible for awards.

Manuscripts and extended abstracts submission deadline Date that authors are notified of acceptance Photo-ready full manuscript submission due date
October 14, 2022 November 18, 2022 January 13, 2023

Upload your paper electronically in RTF, DOC or PDF formats at

For further information please contact the Program Chair
Alex Ockfen, Thermal Engineer, Meta, E-mail:

** All authors qualify for reduced symposium rates **

Detailed Agenda
Author/Speaker Information