38th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium
March 21-25, 2022

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Short Courses

These two-hour classes provide practical, interactive training on a variety of specific skills on topics ranging from thermal design & modeling to system level validation testing. Some are designed for those who are relatively new to thermal management. As such, they focus on basic concepts and techniques. Other classes are meant for seasoned thermal engineers wanting to gain deeper insight into best-in-class tools and practices. Attendees can choose one Short Course in the morning and one in the afternoon.

Short Course 1: 8AM-10:15AM

The Role of Intellectual Property in Protecting Semiconductor Innovation
Instructors: Neil A. Steinberg, Principal, Patent Strategy Group and Dinesh N. Melwani, Partner, Bookoff McAndrews, PLLC

The field of intellectual property extends across the boundaries of business, technology, innovation, and law. Intellectual property is the backbone of the world economy and it plays a vital role in supporting and protecting investment and innovations in the semiconductor industry. Following an overview of the different forms of intellectual property, this course will focus on U.S. Patents, their impact in the semiconductor industry, what they protect and how they are acquired, important considerations when evaluating inventions, and best practices when it comes to inventorship, ownership, and prior art.

Short Course 2a: 10:15AM-12:15PM

Fundamentals of Acoustics
Instructor: David Nelson

A brief practical introduction to the science of acoustics. We’ll de-mystify this topic by discussing the physics of sound waves in air and vibration waves in solids along with human perceptual phenomena, fundamental concepts (frequency, amplitude, sound power, sound pressure), proper terminology, filtering, frequency-weighting (e.g., dBA), and basic decibel math. Audio demonstrations feature prominently. No mathematics beyond logarithms.

Short Course 2b: 1:30PM-3:30PM

Fundamentals of Noise Control
Instructor: David Nelson

A brief practical introduction to noise control engineering. We’ll cover typical acoustical criteria, fundamental noise control strategy including source- path- and receiver noise control, prioritizing what to work on first, basic sound propagation, and applied decibel math. No mathematics beyond logarithms.

[Presumes attendance at Fundamentals of Acoustics or equivalent]

Short Course 2c: 3:30PM-5:30PM

Example Noise Control Applications
Instructor: David Nelson

Three practical applications will illustrate how the fundamentals of Acoustics and Noise Control can be used to provide insight and predict outcomes where noise is important.

  • Noise emission from a fan-cooled rack product
  • Worker noise exposure inside a data center housing fan-cooled racks and support equipment
  • Neighborhood sound levels due to rooftop chillers atop a nearby data center

No mathematics beyond logarithms.[Presumes attendance at Fundamentals of Acoustics or equivalent] [Presumes attendance at Fundamentals of Noise Control or equivalent]

Short Course 3: 8AM-12:15PM

Thermal Comfort Considerations for Electronics Cooling and Design
Instructors: Dr. Mark Hepokoski and Craig Makens

Thermal comfort is a highly complex phenomenon that depends on factors including personal preference, local environment, geographical location, product use case, product type, user interface, geometry, and material to name a few. The wide range of contributing factors results in a large variation in thermal comfort metrics and indicators, including temperature, heat flux, and skin wettedness. Given both the importance and complex nature of thermal comfort in electronics design, a logical process is needed to design for thermal comfort. Successful design for thermal comfort typically requires a combination of user testing and comfort modeling to enable data-driven design decisions. This course provides a detailed overview of thermal comfort-focused test methods and modeling technologies that should be considered and employed in a modern consumer electronics product development process.

Short Course 4: 1:30PM-5:30PM

Photonic and Metamaterial Control of Radiative Heat Transfer
Instructor: Aaswath P. Raman

Nanostructures and microstructures that have deliberately-introduced features below the wavelength of light they’re interacting with can exhibit exquisite tailored control of how light is transmitted, absorbed and emitted. The fields of nanophotonics and metamaterials have emerged over the last thirty years, building on this promise with a range of remarkable capabilities not attainable with conventional materials. More recently, a range of breakthroughs have highlighted how photonic and metamaterial strategies can control thermal emission and radiative heat transfer. This course will provide an introduction to nanophotonics and metamaterials, and their application to controlling radiative heat transfer. Fundamental theoretical frameworks will be introduced, along with a survey of their application to control the spectral and directional characteristics of radiative heat transfer, as well as emerging applications enabled by these advances. Near-field radiative heat transfer will also be discussed in the context of photonic structures that can suppress or enhance this mode of radiative heat transfer.

Technical Sessions 

Each Technical Session typically includes 3 brief presentations (15 minutes plus a 5 minute Q&A) summarizing the design, tests, and findings of research and development efforts. Topics include any thermally related challenge or solution from the die to the facility level. Presentations are generally based on peer reviewed academic research but may also be private sector R&D professionals working alone or as part of an inter-agency program. With over 20 presentations scheduled for the symposium, attendees should expect to have a solid overview of the latest developments in thermal management.

  • Robin Bornoff, Siemens Digital Industries Software
    Application of JESD51-14 to BGA Package Styles
  • Erich Ewy, Intel Corporation
    Subzero System Heating for Outdoor Applications
  • Azita Soleymani, Electronic Cooling solutions Inc.
    Thermal and Hydraulic Characterization of a Double-sided Cold Plate Used in AI Systems
  • Burhan Ozmat, OZER Advanced Technologies
    PCM Infiltrated Metal Foam Based Advanced Passive Heat Exchangers
  • Mohammad Tradat, Binghamton University
    CFD Assessment of Data Centers CRAH Technology Influence Domain for Design and Operation: A Case Study
  • Vibin Shalom Simon, The University of Texas at Arlington
    Characterization of Parallel and Opposed Control Dampers to Observe the Effect on Thermal Mixing of Air Streams in an Air Cooling Unit
  • Sang Muk Kwark, Laird Thermal Systems
    Evaluation of Cooling Capacity of Refrigeration System with Limited Charge of R-290
  • Dinumol Varghese, United Arab Emirates University
    Parametric Study of Fluid Flow and Heat Transfer in Microchannel Heatsink Embedded with Semi-circular Cavities for Thermal Management of Microelectronics Chips
  • Ty Kieger, San José State University
    Computational Analysis of Changing Wavelength and Amplitude Effect on Bottom Rib and Side Rib Wavy Microchannel Heat Sinks
  • Suchismita Sarangi, Intel Corporation
    Single-Phase Immersion Cooling Performance in Intel Servers with Immersion Influenced Heatsink Design
  • Vito Di Pietro, TWI Ltd.
    Manufacturing of Integrated Thermal Management Solutions Using Friction Stir Channelling Derived Process CoreFlow™
  • Claire K Wemp, DuPont
    Measuring Change in Thermal Performance of Multi-layer Laminates after Reliability Testing
  • Dirk Schweitzer, Infineon Technologies AG
    Determination of the Junction-to-Case Top and Bottom Thermal Resistance of Packages with Double Sided Cooling Capability
  • Xuefeng Lin, Laird Thermal Systems
    Optimized Dispensing of Thermal Interface Materials: Issues and Progress
  • Andras Vass-Varnai, Siemens Digital Industries Software
    Characterization of Thermal Interface Materials for Power Electronics Applications
  • Lyndsey Scammell, BNNT Materials LLC
    Boron Nitride Nanotubes for Advanced Thermal Management
  • Javier Avalos Garcia, Intel Corporation
    Intel Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results
  • Jungho Lee, Ajou University
    Thermal Management Device with Boiling-driven Heat Spreader
  • Najmeh Fallahtafti, Binghamton University
    Comparison of Two Designs of an Impingement Two-phase Cooling Cold Plate Intended for High Heat Flux in Data Center
  • Ross Wilcoxon, Collins Aerospace
    Oscillating Heat Pipe Thermal Performance and Stability Limits
  • Lieven Vervecken, Diabatix
    Generative Design and Experimental Validation of a Two-phase Heat Sink

Vendor Workshops

SEMI-THERM exhibitors offer a technical overview of a specific product during these 30 minute presentations. Scheduled throughout the symposium, presenters generally focus on the technical aspects of product selection, implementation and usage that are discussed as part of an engineering system / component discovery effort.

Vendor Exhibits

Be sure to spend some technical face time with the 20+ exhibitors that are available throughout the event to demonstrate and explain their products and services.

Keynote Speaker


Thermi Award Presentation


Embedded Tutorial


Hall of Fame Award Presentation


Symposium Highlights

Technical Sessions

Technical Short Courses


Vendor Exhibits

Vendor Workshops

Product Tear Downs

Panel Discussions

Poster / Dialog Session


Three options for participating in the technical program (additional details provided on FAQs):

Peer-reviewed paper: Submit a full manuscript for peer review in October. Authors notified of acceptance in November. Reviewer comments provided to authors in December. Final manuscript due in January.

Non-peer-reviewed paper: Submit an extended abstract (2-5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November.

Presentation only: Submit an extended abstract (2 -5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final presentation slides are due in March.

Awards: All papers with manuscripts are eligible for the Best Paper Award. Student papers presented at the conference are eligible for Student Scholarships. Presentation-only submissions are not eligible for awards.

Manuscripts and extended
abstracts submission deadline
Date that authors are notified of acceptancePhoto-ready full manuscript
submission due date
Oct 4, 2021Nov 15, 2021Jan 17, 2022