38th Annual Semiconductor Thermal Measurement, Modeling and Management Symposium
March 21-25, 2022

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Call for Papers Deadline Extended until October 29, 2021

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SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. Its goals are to:

  • Provide knowledge covering all thermal length scales from integrated circuits to facility levels
  • Foster discussions between thermal engineers, professionals, and industry experts
  • Encourage the exchange of information on academic and industrial advances in electronics cooling

Topics Include: Component/Board/System Thermal Design, Fluid Movers, Acoustics, Advanced Materials, Measurement Methods, Modeling & Simulation, Additive Manufacturing, Reliability, Design with AI, etc.

Applications Include: Processors/ICs/Memory, 3-D packaging, Computing Systems, Data Centers, Portable/Consumer/Wearable Electronics, Power Electronics, Harsh Environments, Defense/Aerospace Systems; Solid-State Lighting & Cooling, Biomedical; Micro/Nano-scale Devices, etc.

Publishing: Papers will be published in IEEE Xplore and in the SEMI-THERM Technical Library immediately following the symposium.

Thermal Technologies Workshop 2021

Virtual Workshop

December 7-9, 2021

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Announcement and Call for Abstracts

ABSTRACT DEADLINE: October 29, 2021

Abstracts for presentations may be submitted to:

Dave Saums, DS&A LLC, General Chair  Email: dsaums@dsa-thermal.com

Vadim Gektin, Qualcomm Technologies, Inc., Program Chair  Email: atwprogramchair@gmail.com

Join us December 7-9, 2021 for a virtual workshop to be delivered as three live-streamed sessions running from 1:00 p.m. to 6:30 p.m. EST each day (daily start and end times subject to change). You will hear from thought leaders in industry, government, and academia as they address the challenges and trends shaping this burgeoning segment of the electronics industry.

The TTW workshop has been held for more than 25 years and has gained industry attention for the excellence of keynote presentations and first announcements of important technology developments. Keynote presentations in the last five years have been given by speakers from AMD, Collins Aerospace, Georgia Institute of Technology, HPE/Hewlett Packard Laboratories, HP Systems Research Labs, IBM Corporation, Intel Corporation, Microsoft, Qualcomm Technologies, Samsung (Korea), Santa Clara University, The Citadel, and University of Colorado.

Symposium Highlights

Technical Sessions

Technical Short Courses


Vendor Exhibits

Vendor Workshops

Product Tear Downs

Panel Discussions

Poster / Dialog Session


Three options for participating in the technical program (additional details provided on FAQs):

Peer-reviewed paper: Submit a full manuscript for peer review in October. Authors notified of acceptance in November. Reviewer comments provided to authors in December. Final manuscript due in January.

Non-peer-reviewed paper: Submit an extended abstract (2-5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November.

Presentation only: Submit an extended abstract (2 -5 pages) that describes the scope, contents, key results, findings and conclusions. Authors notified of acceptance in November. Final presentation slides are due in March.

Awards: All papers with manuscripts are eligible for the Best Paper Award. Student papers presented at the conference are eligible for Student Scholarships. Presentation-only submissions are not eligible for awards.

Manuscripts and extended
abstracts submission deadline
Date that authors are notified of acceptancePhoto-ready full manuscript
submission due date
Oct 4, 2021Nov 15, 2021Jan 17, 2022