SEMI-THERM Annual Awards

34th Annual

Semiconductor Thermal Measurement, Modeling and Management Symposium March 19-23, 2018 Doubletree Hotel, San Jose, CA


Each year since 1991 the IEEE SEMI-THERM Symposia honors a person as a Significant Contributor to the field of semiconductor thermal management. The THERMI award is intended to recognize a recipient’s history of contributions to important thermal issues affecting the performance of semiconductor devices, optoelectronics, MEMS or related systems. Nominees are typically leaders in the field of heat transfer in the disciplines of measurement, modeling and testing of microelectronic, optoelectronic and other technology devices and equipment. The award is open to anyone in the field of semiconductor/computer, optical, and high technology thermal management and may come from industry, government or academia. No connection with SEMI-THERM, past or present, is required.

The award will be presented at a special ceremony at the 34th Annual SEMI-THERM Symposium on Thermal Measurement, Modeling and Management, March 19-23, 2018 in San Jose, California. The recipient is requested to author a journal quality paper and present it at the awards ceremony. Typically, the paper is a summary of achievements
and advances fostered by the recipient, but the topic is the author’s choice. The paper will be published in the conference Journal if received by the publisher’s cutoff date.


Please provide the required information to place a name in nomination for this prestigious award. Be as complete as possible and include any material or information supporting the nomination to help the selection committee determine the honoree.

The THERMI Awards Chair must receive the nomination and associated materials no later than September 30, 2017 to be considered for the 2018 award.



ES2: Center for Energy-Smart Electronic Systems
Department of Mechanical and Aerospace Engineering University of Texas at Arlington
ES2: Center for Energy-Smart Electronic Systems

We are proud to sponsor:

The SEMI-THERM Educational Foundation
Thermal Hall of Fame Inductee for 2018

Lifetime Achievement Award

Presented To

Bernie Siegal

In Recognition of Significant Contributions
to the Field of Electronics Thermal Management

Bernie Siegal’s first involvement in semiconductor thermal matters came in 1966 while working at the microwave semiconductor group within Hewlett-Packard Associates (HPA). Bernie and an associate developed an automated system for making thermal resistance measurements on microwave diodes and authored a feature article describing the method, which appeared in the October 1967 issue of the HP Journal. From that beginning to today, Bernie has been an active participant in the semiconductor measurement, modeling and management field. In 1974, Bernie founded SAGE Enterprises, Inc. and began offering test equipment for measurement of thermal resistance for many different types of semiconductor devices. The thermal testing techniques Bernie developed eventually became incorporated into many of the industry (SEMI and EIA/JEDEC) and US military measurement (Mil Std 750) standards. Besides being actively involved in many of the various standards-creating committees, Bernie is co-founder and primary force behind the start of SEMI-THERM, the premier technical symposium in the field. He has authored over 40 technical papers, presented seminars to world-wide audiences, and conducted several short courses for the UC Berkeley Extension program. His current company, THERMAL ENGINEERING ASSOCIATES, INC. (TEA), maintains his involvement in the field. Bernie holds M.B.A. (Santa Clara University), M.S.E.E. (San Jose State University), and B.S.E.E. (Cornell University) degrees. He was elected a Fellow of the IEEE and received the IEEE Signifcant Contributor Award for his work in the semiconductor thermal field. He currently serves as the Chairman of the IEEE CPMT Silicon Valley Chapter.

The THERMI Award

Each year, SEMI-THERM honors a person as a Significant Contributor to the field of semiconductor thermal management. The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems.

The voting body of past THERMI winners and the current year General Chair are pleased to present the 2018 THERMI Award to:

Dr. Bruno Michel

IBM Zurich Research Laboratory

Bruno Michel received a Ph.D. degree in biochemistry and computer engineering from the University of Zurich, subsequently joining IBM Research to work on scanning probe microscopy and accurate large-area soft lithography. As part of the Advanced Micro Integration effort he improved thermal interfaces and miniaturized convective cooling. Based on this technology and heat driven heat pumps he demonstrated improved efficiency and energy re-use in datacenters as well as photovoltaic thermal solar concentrators. He developed microfluidics, 3D packaging with interlayer cooling and electrochemical chip power supply as a new density roadmap that can replace the currently slowing Moore’s Law. Most recently he is focusing on smart system integration of IoT and wearable devices, combining efforts that span from new sensing principles over ultra-miniaturized compute platforms to multi sensor data fusion and cognitive computing.

The 2017 Harvey Rosten Award


Paper: Lifetime Isoflux Control of LED Based Light Sources
János Hegedüs, Gusztáv Hantos, András Poppe

For Outstanding Work in the Field of Thermal Analysis of Electronic Equipment.

János Hegedüs received his BSc degree in electrical engineering from the Budapest University of Technology and Economics (BME, Hungary) in 2012 and completed the joint Erasmus+ international master’s program of BME, the Heriot Watt University (UK) and the Vestfold University Collage (Norway) with an MSc degree in smart systems integration in 2015. He has been active in LED multi-domain characterization since 2013, starting as an engineering intern at Mentor Graphics MicReD where he conducted combined thermal and radiometric/photometric measurements of LEDs in order to derive the first multi-domain LED models aimed for a commercial thermal simulator. His BSc and MSc thesis were also related to LED modelling and currently he is working towards his PhD at BME, Department of Electron Devices in the field of LED modelling, considering also the elapsed LED operating time. János Hegedüs is actively involved now in the Delphi4LED H2020 ECSEL project of the EU.

Gusztáv Hantos received his electrical engineering BSc and MSc degrees from the Budapest University of Technology and Economics (BME) in 2009 and in 2012, respectively. He also obtained an MBA degree from BME in 2012. Currently he is the manager of BME’s thermal testing laboratory. He has been participating in BME’s thermal research projects since 2009. Most recently he coordinated the LED round-robin testing of the Delphi4LED project. He conducted MOSFET and LED ageing and reliability experiments in the NANOTHERM project of the EU and he contributed to OLED multi-domain characterization in the framework of the Fast2Light EU FW7 project. Currently he is working on his PhD dissertation related to reliability testing of semiconductor components.

András Poppe obtained his PhD degree from the Budapest University of Technology and Economics (BME) in 1996. Currently he is the head of the Department of Electron Devices of BME. He has been active in characterization of LEDs and OLEDs since 2003; he initiated the development of an equipment aimed at the combined thermal and radiometric/photometric testing of power LEDs. He also has more than 2 decades of expertise in multi-domain modelling and simulation of semiconductor devices. He had significant contributions to JEDEC’s and CIE’s LED testing standards /recommendations; currently he is chairing the TC2-84 technical committee of CIE and is an active member of the JEDEC JC15 committee. András Poppe is the leader of the LED modelling workpackage of the Delphi4LED project of the EU.

The Harvey Rosten Award

The award is for outstanding work, recently published or in the public domain, which advances the analysis or modeling of thermal or thermomechanical effects in electronic equipment or components, including experiments aimed specifically at the validation of numerical models. The award is in the form of a plaque and a $1000 cash prize. The award was established by the family and friends of Harvey Rosten, to commemorate his achievements in the field of thermal analysis of electronics equipment, and the thermal modeling of electronics parts and packages. The Award is made annually to encourage innovation and excellence in these and closely related fields. The recipient is selected by the Selection Committee, made up of eminent practitioners in the electronics-thermal field.

The criteria for selection are:
• The work represents an advance in thermal analysis or thermal modeling of electronics equipment or components, including experiments aimed specifically at validating numerical models.
• The work demonstrates clear application to practical electronics design.
• The work demonstrates insight into the physical processes affecting the thermal behavior of electronics components, parts and systems.
• The work is innovative in embodying this understanding in either thermal analysis or thermal modeling.
• A pragmatic approach is taken in the application of the work.

Best Paper Award SEMI-THERM 34

Awarded to Michael Gaynes, Universal Instruments Corporation 
Using Electrical Capacitance and Mechanically Representative Hardware to Evaluate the Thermal Mechanical Stability of Thermal Interface Materials

Michael Gaynes 1, Lauren Boston 2, Andrew Yu 2
1.Universal Instruments Corporation
2.Binghamton University

Thermal Hall of Fame, Lifetime Achievement Award

2016 – Bob Simons, IBM (retired)
2017 – Robert Moffat, Stanford University (Emeritus)

Past Winners of the THERMI Award

1991 – Robert Moffat, Stanford University (Emeritus)
1993 – Bernie Siegal, Thermal Engineering Associates
1994 – Allan Kraus, Naval Postgraduate School
1995 – Bob Simons, IBM
1996 – Gordon Ellison, Thermal Computations, Inc.
1997 – Avram Bar-Cohen, Univ. of Minnesota (now, U. Maryland)
1998 – Harvey Rosten*, Flomerics
1999 – Richard Chu, IBM
2000 – Kaveh Azar, Lucent Technologies 2001 – Clemens J. M. Lasance, Philips Research Labs
2002 – Al Ortega, University of Arizona
2003 – Micahel M. Yovanovich, University of Waterloo
2004 – Roger R. Schmidt, IBM
2005 – Thomas S. Tarter, Neophotonics
2006 – Wataru Nakayama, ThermTech International
2007 – David L. Blackburn, NIST
2008 – Dereje Agonafer, Dr. Martin Luther King, Jr. Visiting Professor, MIT
2009 – Yogendra Joshi, School of Mechanical Engineering, Georgia Institute of Technology
2010 – Bruce Guenin, Sun Microsystems
2011 – James S. Wilson, Raytheon
2012 – Dr. Bahgat G. Sammakia
2013 – Kenneth E. Goodson, PhD
2014 – Ali Shakouri, PhD
2015 – Christian Belady, General Manager, Data Center Services Microsoft Global Foundation Services
2016 – Dr. Ravi-Mahajan, Intel
2017 – Chandrakant D. Patel, HP Senior Fellow and Chief Engineer, HP Inc