Technical Library

TitleClassAuthorOther AuthorKeywordsView Record
Validated Model Calibration for S imulation Aided Thermal D esign R. Cioban Sz. Szőke, Z. Kórádi, D. Zaharie-B., C. Leordean Thermal model, optimization, verification, LFPAK VIEW
Effects of Solder Voiding on the Reliability and Thermal Characteristics of Quad Flatpack No-lead (QFN) Components Ross Wilcoxon Dave Hillman and Tim Pearson Quad flatpack no-lead (QFN), Solder voiding, thermal resistance VIEW
Thermal Characterization of a Virtual Reality Headset during Transient and Resting Operation Rachel McAfee Cole Haxton, Matthew Harrison, Joshua Gess Wearable, thermal management, consumer products, Virtual Reality, comfort measurements, free convection, heat transfer VIEW
Experimental Measurement and Finite Element Analysis of the Thermal Conductivity of Alumina / Silicone Polymer Composites Masakazu Hattori Yasushi Kajita Kazuaki SANADA, Thermal Conductivity, Composite Material, Thermal Interface Material, Transient Method, Steady-State Method, Finite element analysis, RVE Model VIEW
Cross Correlation Method for Images Alignment: Application to 4 Buckets Calculation in Thermoreflectance Metayrek Youssef Kociniewski Thierry, Khatir Zoubir Cross correlation, phase correlation, thermal expansion, thermoreflectance, 4 buckets, calibration. VIEW
General Guidelines for Commercialization a Small-Scale In-Row Cooled Data Center: A Case Study Yaman. M. Manaserh Mohammad. I. Tradat, Ghazal Mohsenian, Bahgat G. Sammakia, Mark J. Seymour Numerical Study, Cold Aisle Containments, Small Scale Data Centers, In-Row Cooled Data Centers, Data Center Thermal Management VIEW
Design and Optimization of Hollow Micropillar Structures for Enhanced Evaporative Cooling of High-Powered Electronics Mun Mun Nahar Haotian Wu1, Zhikai Yang1, Alexander Austin1, Jorge Padilla2, Madhusudan Iyengar2, Damena Agonafer Micropillar Structures, Enhanced Evaporative Cooling VIEW
Numerical Investigation of Coolants for Chip-embedded Two-Phase Cooling Pritish R. Parida Timothy Chainer Two-phase cooling, micro pin-fins, thermal modeling, flow boiling. VIEW
Measurement of Performance Characterization of Ultra-Thin Vapor Chamber Wei-Keng Lin Wen-Hua Zhang, Chien Huang, Ching-Huang Tsai, Kenny Hsaio Thermal diffusivity; ultra-thin vapor chamber; heat pipe VIEW
An Analysis of Temperature Variation Effect on Response and Performance of Capacitive Microaccelerometer Inertial Sensors Jacek Nazdrowicz Andrzej Napieralski MEMS, accelerometer, inertial sensor, capacitances VIEW
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Dynamic Rack Power Provision to Optimize Rack Power Performance Heat Sink Song, Chuan Jiang, Feng; Liang, Xiaoguo; Zhao, Zheng; Liu, Xingxing; Sun, Yanbing; Ahuja, Nishi; Kumar, Mohan J; Zhou, Xiang; Li, Xiaozhong; Zhang, Lifei Power Capping, RAPL (Running Average Power limiting), Peak shaving, Battery Backup System(BBS), Dynamic Rack Power Provision (DRPP), Uninterrupted Power System (UPS) VIEW
Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink Thermal Design Andrew Werdowatz Nicole Okamoto and Hussameddine Kabbani Thermal spreading resistance, heat sink VIEW
In Search of a Quiet Fan Application David A. Nelson Richard W. Bonner III Cooling fan, acoustics, sound power VIEW
Using SMT Chip Resistors Beyond Their Rated Thermal Specification Application Jeevan Kanesalingam1 Fabian Kung Emissivity, thermal camera, derating, SMT Resistor VIEW
Thermal Resistance of Electrical Insulation for Bolted and Clamped Discrete Power Devices Thermal Characterization Mikel Garcia-Poulin Mehran Ahmadi, Majid Bahrami, Eric Lau, and Chris Botting Transistor Mounting, Thermal Measurement, High Voltage VIEW
Use of High Conductivity Spreaders on the Back of Single-Sided PCB to Enhance Heat Transfer and Thermal Capacitance in Electronics Systemsnn Heat Spreader Joshua Een Joshua Een Heat spreader, transient response, steady state VIEW
Application of Thermal Network Approach to Electrical-Thermal Co-simulation and Chip-Package-Board Extraction Simulation Software Fengyun Zhao Yuanbin Cai, Zipeng Luo, An-Yu Kuo, Xin Ai, C. T. Kao and Zhemin Zhuang System level, electrical-thermal, dynamic thermal model VIEW
Lightweight and High-Performance Air-Cooled Heat Sinks Heat Sink Mohammad Reza Shaeri Richard W. Bonner III Heat sink, perforated fin, Pumping power, Thermal resistance VIEW
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Analysis of Natural Frequency Dependency on Temperature Variation of MEMS Vibratory Gyroscope Jacek Nazdrowicz Andrzej Napieralski MEMS, vibratory gyroscope, spring constant, damping coefficient, natural frequency, temperature dependency VIEW
Battery Discharge Capacity Calculation by Temperature Measurement Jeevan Kanesalingam Khoo Li Lian Capacity, battery, temperature VIEW
Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling Binjian Ma Shan Li, Damena Agonafer, Baris Dogruoz VIEW
Thermal Performance of Metal Foam Heat Sink with Pin Fins for Non-Uniform Heat Flux Electronics Cooling Yongtong Li Liang Gong, Minghai Xu, Yogendra Joshi Metal foam heat sink, heat transfer, numerical simulation VIEW
A Methodology to Determine the Sites of Variability in an LED Assembly Robin Bornoff Thomas Mérelle, Josephine Sari, Alessandro Di Bucchianico, Gabor Farkas LED, Structure Function, Variation VIEW
Exploring Heatpipe Configurations for Package On Package (PoP) Cooling Dr. Sankarananda Basak PoP, PCB, TIM, Heat pipe VIEW
Transient Analysis Overshoot in Temperature for High Power Thermal Solutions Javier Avalos Enrique Barreto Transient, heat sink, fan speed control VIEW
Simulation-Based Optimization of Data Center Cooling Performance Using Performance Indicators John Petrongolo Kourosh Nemati and Kamran Fouladi VIEW
Implementation of a Multi-domain LED Model and its Application for Optimized LED Luminaire Design János Hegedüs Gusztáv Hantos, Robin Bornoff, Márta Rencz, András Poppe LED mult-domain modelling, compact modelling, SPICE models, spreadsheet application VIEW
The Impact of Anodization on the Thermal Performance of Passively Cooled Electronic Enclosures Made of Die-cast Aluminum Zhongchen Zhang Michael Collins, Chris Botting, Eric Lau, Majid Bahrami Thermal radiation, Natural Convection, Anodization, Electronic cooling VIEW
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SOLDER JOINT INTEGRITY EVALUATION OF QFN COMPONENTS WITH VOIDING Ross Wilcoxon Tim Pearson, Dave Hillman Solder Joint, Integrity, Voiding VIEW
Vaporizable Dielectric Fluid Cooling of IGBT Power Semiconductors and Military EV Powertrain Inverters David L. Saums IGBT, Dielectric, Vapor VIEW
Thermal & Hydraulic Performance of Refrigerant Based Two-Phase Cold Plates: Experimental Characterization and System Performance Alfonso Ortega Felipe Valenzuela Gaete, Steven Schon VIEW
Design of Cool Headphones Guy Wagner Skin Temperature, Tissue Conductivity VIEW
Micro-encapsulated phase change materials as heat transfer media in electronics John D. Rasberry phase change, heat transfer media VIEW
Liquid Cooling System for a 17 kW Artificial Intelligence Module using FloTHERM XT Guy Wagner Liquid Cooling, Heat Exchanger, Simulation VIEW
Thermo-Mechanical Analysis of a Printed Circuit Board Mehdi Abarham Multiphysics, Reliability, Structural Analysis VIEW
Leveraging BCI Reduced Order Models John Wilson, Electronics Thermal Business Development Byron Blackmore, Simcenter Flotherm Product Manager Model, VIEW
Supercritical CO2 Cooling Alec Nordlund CO2, VIEW