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A Thermal Performance Characterization Method for Thin Vapor Chambers by Photonics Technologies Kuang-Yu Hsu Wei-Keng Lin, Yi-Jing Chu, Ming-Hsien Hsaio, and Chiao-Jung Tien Non-contact thermal characterization, vapor chamber, transient analysis VIEW
A New Edge Micro Data Center and its Passive Thermosyphon Cooling System at TUe: Cooling System Thermal Performance Tests Enzo Minazzo Enzo Minazzo, John R. Thome, Jackson B. Marcinichen, Sean Ahearne, Fred Buining, Simon Rommel, Bruno Cimoli, Idelfonso Tafur Monroy, Janos Lazanyi, Mark Fleuren VIEW
Benefits and Challenges of PCM-based Thermal Management at the Die and Component Level M. Bhatasana A. Marconnet VIEW
Thermal Management of Wide-Bandgap Semiconductor Amplifiers used for Plasma Heating and Control Sangeeta P. Vinoth Xuhui Feng, Christopher Galea, Gilbert Moreno, Michael Paluszek, Sreekant Narumanchi VIEW
Advanced Heat Removal, An Electronics Overmolding Advantage Troy S Diaz VIEW
Liquid Metal Embedded Elastomers (LMEE) as Low-BLT Thermal Interface Materials Keyton Feller Dylan Shah, Loran Russel, Navid Kazem VIEW
Modeling the Impact of Thermal Management on Electric Vehicle Energy Consumption and Driving Range Timofey Golubev Logan Canull, and Zachary Edel Electric Vehicle, Energy Consumption, Thermo-electrical Model, Battery Pack VIEW
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations James Petroski Andy Carrasco Solder Fatigue VIEW
Thermal Characterization of Multi-Source Devices: Alternative Way to Determine the Thermal Characterization Matrix Dirk Schweitzer Marco Pennetti Multi-chip devices, thermal characterization matrix (TCM) VIEW
Investigation of Flow Restrictors for Rack Level Two-Phase Cooling under Nonuniform Heating Serdar Ozguc Qingyang Wang, Akshith Narayanan, Richard W. Bonner III Flow boiling, flow maldistribution, direct-to-chip cooling, data center cooling VIEW
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Lightweight and High-Performance Air-Cooled Heat Sinks Heat Sink Mohammad Reza Shaeri Richard W. Bonner III Heat sink, perforated fin, Pumping power, Thermal resistance VIEW
Application of Thermal Network Approach to Electrical-Thermal Co-simulation and Chip-Package-Board Extraction Simulation Software Fengyun Zhao Yuanbin Cai, Zipeng Luo, An-Yu Kuo, Xin Ai, C. T. Kao and Zhemin Zhuang System level, electrical-thermal, dynamic thermal model VIEW
Dynamic Rack Power Provision to Optimize Rack Power Performance Heat Sink Song, Chuan Jiang, Feng; Liang, Xiaoguo; Zhao, Zheng; Liu, Xingxing; Sun, Yanbing; Ahuja, Nishi; Kumar, Mohan J; Zhou, Xiang; Li, Xiaozhong; Zhang, Lifei Power Capping, RAPL (Running Average Power limiting), Peak shaving, Battery Backup System(BBS), Dynamic Rack Power Provision (DRPP), Uninterrupted Power System (UPS) VIEW
Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink Thermal Design Andrew Werdowatz Nicole Okamoto and Hussameddine Kabbani Thermal spreading resistance, heat sink VIEW
In Search of a Quiet Fan Application David A. Nelson Richard W. Bonner III Cooling fan, acoustics, sound power VIEW
Using SMT Chip Resistors Beyond Their Rated Thermal Specification Application Jeevan Kanesalingam1 Fabian Kung Emissivity, thermal camera, derating, SMT Resistor VIEW
Thermal Resistance of Electrical Insulation for Bolted and Clamped Discrete Power Devices Thermal Characterization Mikel Garcia-Poulin Mehran Ahmadi, Majid Bahrami, Eric Lau, and Chris Botting Transistor Mounting, Thermal Measurement, High Voltage VIEW
Use of High Conductivity Spreaders on the Back of Single-Sided PCB to Enhance Heat Transfer and Thermal Capacitance in Electronics Systemsnn Heat Spreader Joshua Een Joshua Een Heat spreader, transient response, steady state VIEW
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Analysis of Natural Frequency Dependency on Temperature Variation of MEMS Vibratory Gyroscope Jacek Nazdrowicz Andrzej Napieralski MEMS, vibratory gyroscope, spring constant, damping coefficient, natural frequency, temperature dependency VIEW
Battery Discharge Capacity Calculation by Temperature Measurement Jeevan Kanesalingam Khoo Li Lian Capacity, battery, temperature VIEW
Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling Binjian Ma Shan Li, Damena Agonafer, Baris Dogruoz VIEW
Thermal Performance of Metal Foam Heat Sink with Pin Fins for Non-Uniform Heat Flux Electronics Cooling Yongtong Li Liang Gong, Minghai Xu, Yogendra Joshi Metal foam heat sink, heat transfer, numerical simulation VIEW
A Methodology to Determine the Sites of Variability in an LED Assembly Robin Bornoff Thomas Mérelle, Josephine Sari, Alessandro Di Bucchianico, Gabor Farkas LED, Structure Function, Variation VIEW
Exploring Heatpipe Configurations for Package On Package (PoP) Cooling Dr. Sankarananda Basak PoP, PCB, TIM, Heat pipe VIEW
Transient Analysis Overshoot in Temperature for High Power Thermal Solutions Javier Avalos Enrique Barreto Transient, heat sink, fan speed control VIEW
Simulation-Based Optimization of Data Center Cooling Performance Using Performance Indicators John Petrongolo Kourosh Nemati and Kamran Fouladi VIEW
Implementation of a Multi-domain LED Model and its Application for Optimized LED Luminaire Design János Hegedüs Gusztáv Hantos, Robin Bornoff, Márta Rencz, András Poppe LED mult-domain modelling, compact modelling, SPICE models, spreadsheet application VIEW
The Impact of Anodization on the Thermal Performance of Passively Cooled Electronic Enclosures Made of Die-cast Aluminum Zhongchen Zhang Michael Collins, Chris Botting, Eric Lau, Majid Bahrami Thermal radiation, Natural Convection, Anodization, Electronic cooling VIEW
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Direct Micro-Pin Jet Impingement Cooling for High Heat Flux Applications Vahideh Radmard Yaser Hadad, Arad Azizi, Srikanth Rangarajan, C. Hiep Hoang, Charles Arvin, Kamal Sikka, Scott N. Schiffres, Bahgat Sammakia Jet Impingement, High Heat Flux VIEW
Shape Optimization of a Pin Fin Heat Sink Thomas Menrath A. Rosskopf, F. B. Simon, M. Groccia, S. Schuster Pin Fin, Shape Optimization, additive manufacturing VIEW
Capillary wicking enhancement of micropillar forest geometry by laser induced roughness Sougata Hazra Farid Soroush, Tanya Liu, Mehdi Asheghi, Kenneth E. Goodson Two Phase, Wicking, VIEW
Determination of Cost Savings Using Variable Speed Fans for Cooling Servers Minh Tran Nicole Okamoto, Hussammedine Kabbani, Saeid Bashash Variable Speed Fans, Cost Savings, Servers, PUE VIEW
On Economic Cooling of Contained Server Racks using an Indirect Adiabatic Air Handler Riccardo Lucchese Michele Lionello, Mirco Rampazzo, Andreas Johansson, Wolfgang Birk Data center thermal models, Indirect adiabatic cooling, Server thermal models VIEW
An Experimental Apparatus for Two -phase Cooling of High Heat Flux Application using an Impinging Cold Plate and Dielectric Coolant Cong Hiep Hoang Sadegh Khalili, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Vahideh Radmard, Kamal Sikka, Scott Schiffres, Bahgat Sammakia Two-phase cooling; microchannel; boiling VIEW
CFD Investigation of Dispersion of Airborne Particulate Contaminants in a Raised Floor Data Center Satyam Saini Pardeep Shahi, Pratik Bansode, Ashwin Siddarth, Dereje Agonafer CFD, Particle Transport, Data Center, Servers, Contamination VIEW
Experimental Validation of a Numerically-Optimized Array of Heat Sinks Georgios Karamanis Marc Hodes CFD, FNM, MVO VIEW
General Guidelines for Commercialization a Small-Scale In-Row Cooled Data Center: A Case Study Yaman. M. Manaserh Mohammad. I. Tradat, Ghazal Mohsenian, Bahgat G. Sammakia, Mark J. Seymour Numerical Study, Cold Aisle Containments, Small Scale Data Centers, In-Row Cooled Data Centers, Data Center Thermal Management VIEW
Self-Heating Investigation in SOI MOSFET Structures with High Thermal Conductivity Buried Insulator Layers Konstantin Petrosyants Dmitry Popov SOI MOSFETs, buried oxide (BOX), buried insulator layers, thermal conductivity, self-heating, power dissipation VIEW
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Unified Approach to Model Closed-Loop Liquid Cooling Albert Chan Don Nguyen, Michael Brooks Liquid cooling, closed-loop, pump, cold plate, heatexchanger, thermal resistance. effectiveness, NTU VIEW
Sensitivity Analysis of a Calibrated Data Center Model to Minimize the Site Survey Effort Saurabh Singh Kourosh Nemati, Vibin Simon, Ashwin Siddarth, Mark Seymour, Dereje Agonafer Digital Twin, data center, calibration, sensitivity VIEW
Effects of Different Coolants on the Cooling Performance of an Impingement Microchannel Cold Plate Cong Hiep Hoang Ghazal Mohsenian, Najmeh Fallatafti, Vahideh Radmard, Srikanth Rangarajan, CharlesArvin, Kamal Sikka, Scott Schiffres, Bahgat Sammakia Liquid cooling, microchannel, impingement, thermalresistance, pressure drop VIEW
Effects of Solder Voiding on the Reliability and Thermal Characteristics of Quad Flatpack No- lead (QFN) Components Ross Wilcoxon Dave Hillman, Tim Pearson Quad flatpack no-lead (QFN), Solder voiding, thermalresistance VIEW
Analysis of Temperature Variation Effect on Response and Performance of Capacitive Microaccelerometer Inertial Sensors Jacek Nazdrowicz Andrzej Napieralski MEMS, accelerometer, inertial sensor, capacitances VIEW
Including Electrothermal Effects in Electronics Design with Connected FANTASTIC BCI-ROMs Byron Blackmore Mike Donnelly, Mahmood Alkhenaizi BCI-ROM, VHDL-AMS, Electrothermal VIEW
Thermohydraulic Performance of Heat Sink with Sinusoidal Microchannels Embedded with Pin- Fins for Liquid Cooling of Microelectronic Chips Anas Alkhazaleh Fadi Alnaimat, Mohamed Younes El-Saghir Selim, Bobby Mathew Liquid cooling, pumping power, pin fin, sinusoidalmicrochannel, thermal resistance VIEW
Increased System Performance and Reduced Surface Touch (Skin) Temperature in Mobile Electronics Utilizing Composites of Graphite with Ultra-High Spreading Capacity and Insulation with Ultra-Low Thermal Conductivity Mitchell Warren Julian Norley, John Allen, Jonathan Taylor, Lindsey Keen Graphite, ultra-high spreading capacity, insulation, ultra-low thermal conductivity, composite, heat spreader, thermal conductivity, thickness, surface touch (skin) temperature, hot spot, junction temperature, ambient temperature, steady-state, Google Pix VIEW
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Single-Phase Immersion Cooling Performance in Intel Servers with Immersion Influenced Heatsink Design Suchismita Sarangi Eric D. McAfee, Drew G. Damm, Jessica Gullbrand VIEW
COMPUTATIONAL ANALYSIS OF CHANGING WAVELENGTH ON BOTTOM RIB AND SIDE RIB WAVY MICROCHANNEL HEAT SINKS Ty Kieger Heat transfer, wavy microchannel heat sinks,computational fluid dynamics (CFD), thermal management VIEW
Evaluation of Cooling Capacity of Refrigeration System with Limited Charge of R-290 Alan Jones Arne Wolf, Sang Muk Kwark Charging limit, Cooling Capacity, Flammable Refrigerant, Global Warming Potential VIEW
Generative Design and Experimental Validation of a Two-phase Heat Sink Lieven Vervecken Joris Coddé, Roxane Van Mellaert, Joao Miranda Generative Design, Two-phase Flow, Optimization VIEW
Design Improvement of a Commercial Impingement Two-Phase Cold Plate Used for High Heat Flux Applications Najmeh Fallahtafti Cong Hiep Hoang, Yaser Hadad, Srikanth Rangarajan, Scott Schiffres, Bahgat Sammakia VIEW
Measuring Change in Thermal Performance of Multi-layer Laminates after Reliability Testing Claire K. Wemp VIEW
Thermal management device with boiling-driven heat spreader Hyunmuk Lim Dong Hwan Shin, Gwang Hoon Rhee, Seung M. You, Jungho Lee VIEW
Application of JESD51-14 to BGA Package Styles Robin Bornoff JESD51-14, TDIM, Rjc, thermal characterization VIEW
Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results Javier Avalos Oscar del Rio, Oscar Farias VIEW
Characterization of parallel and opposed control dampers to observe the effect on thermal mixing of air streams in an air-cooling unit Pavan Kaulgud Ashwin Siddarth, Vibin Shalom Simon, Dereje Agonafer Air Side Economization, Control Dampers, Paralleldamper, opposed damper, straight line law, mixing chamber,air handling unit, datacenter air cooling VIEW
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SOLDER JOINT INTEGRITY EVALUATION OF QFN COMPONENTS WITH VOIDING Ross Wilcoxon Tim Pearson, Dave Hillman Solder Joint, Integrity, Voiding VIEW
Vaporizable Dielectric Fluid Cooling of IGBT Power Semiconductors and Military EV Powertrain Inverters David L. Saums IGBT, Dielectric, Vapor VIEW
Thermal & Hydraulic Performance of Refrigerant Based Two-Phase Cold Plates: Experimental Characterization and System Performance Alfonso Ortega Felipe Valenzuela Gaete, Steven Schon VIEW
Design of Cool Headphones Guy Wagner Skin Temperature, Tissue Conductivity VIEW
Micro-encapsulated phase change materials as heat transfer media in electronics John D. Rasberry phase change, heat transfer media VIEW
ADDITIVELY MANUFACTURED LIQUID COLD PLATE: LESSONS LEARNED ROSS WILCOXON ADDITIVE MANUFACTURE, LIQUID COLD PLATE VIEW
Liquid Cooling System for a 17 kW Artificial Intelligence Module using FloTHERM XT Guy Wagner Liquid Cooling, Heat Exchanger, Simulation VIEW
Thermo-Mechanical Analysis of a Printed Circuit Board Mehdi Abarham Multiphysics, Reliability, Structural Analysis VIEW
Leveraging BCI Reduced Order Models John Wilson, Electronics Thermal Business Development Byron Blackmore, Simcenter Flotherm Product Manager Model, VIEW
Supercritical CO2 Cooling Alec Nordlund CO2, VIEW
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TitleClassAuthorOther AuthorKeywordsView Record
A Thermal Performance Characterization Method for Thin Vapor Chambers by Photonics Technologies Kuang-Yu Hsu Wei-Keng Lin, Yi-Jing Chu, Ming-Hsien Hsaio, and Chiao-Jung Tien Non-contact thermal characterization, vapor chamber, transient analysis VIEW
A New Edge Micro Data Center and its Passive Thermosyphon Cooling System at TUe: Cooling System Thermal Performance Tests Enzo Minazzo Enzo Minazzo, John R. Thome, Jackson B. Marcinichen, Sean Ahearne, Fred Buining, Simon Rommel, Bruno Cimoli, Idelfonso Tafur Monroy, Janos Lazanyi, Mark Fleuren VIEW
Benefits and Challenges of PCM-based Thermal Management at the Die and Component Level M. Bhatasana A. Marconnet VIEW
Thermal Management of Wide-Bandgap Semiconductor Amplifiers used for Plasma Heating and Control Sangeeta P. Vinoth Xuhui Feng, Christopher Galea, Gilbert Moreno, Michael Paluszek, Sreekant Narumanchi VIEW
Advanced Heat Removal, An Electronics Overmolding Advantage Troy S Diaz VIEW
Liquid Metal Embedded Elastomers (LMEE) as Low-BLT Thermal Interface Materials Keyton Feller Dylan Shah, Loran Russel, Navid Kazem VIEW
Modeling the Impact of Thermal Management on Electric Vehicle Energy Consumption and Driving Range Timofey Golubev Logan Canull, and Zachary Edel Electric Vehicle, Energy Consumption, Thermo-electrical Model, Battery Pack VIEW
Simulation of Solder Fatigue Effects on Typical BGA Package due to Material and Temperature Variations James Petroski Andy Carrasco Solder Fatigue VIEW
Thermal Characterization of Multi-Source Devices: Alternative Way to Determine the Thermal Characterization Matrix Dirk Schweitzer Marco Pennetti Multi-chip devices, thermal characterization matrix (TCM) VIEW
Investigation of Flow Restrictors for Rack Level Two-Phase Cooling under Nonuniform Heating Serdar Ozguc Qingyang Wang, Akshith Narayanan, Richard W. Bonner III Flow boiling, flow maldistribution, direct-to-chip cooling, data center cooling VIEW