Technical Library
Title | Class | Author | Other Author | Keywords | View Record |
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Validated Model Calibration for S imulation Aided Thermal D esign | R. Cioban | Sz. Szőke, Z. Kórádi, D. Zaharie-B., C. Leordean | Thermal model, optimization, verification, LFPAK | VIEW | |
Effects of Solder Voiding on the Reliability and Thermal Characteristics of Quad Flatpack No-lead (QFN) Components | Ross Wilcoxon | Dave Hillman and Tim Pearson | Quad flatpack no-lead (QFN), Solder voiding, thermal resistance | VIEW | |
Thermal Characterization of a Virtual Reality Headset during Transient and Resting Operation | Rachel McAfee | Cole Haxton, Matthew Harrison, Joshua Gess | Wearable, thermal management, consumer products, Virtual Reality, comfort measurements, free convection, heat transfer | VIEW | |
Experimental Measurement and Finite Element Analysis of the Thermal Conductivity of Alumina / Silicone Polymer Composites | Masakazu Hattori Yasushi Kajita | Kazuaki SANADA, | Thermal Conductivity, Composite Material, Thermal Interface Material, Transient Method, Steady-State Method, Finite element analysis, RVE Model | VIEW | |
Cross Correlation Method for Images Alignment: Application to 4 Buckets Calculation in Thermoreflectance | Metayrek Youssef | Kociniewski Thierry, Khatir Zoubir | Cross correlation, phase correlation, thermal expansion, thermoreflectance, 4 buckets, calibration. | VIEW | |
General Guidelines for Commercialization a Small-Scale In-Row Cooled Data Center: A Case Study | Yaman. M. Manaserh | Mohammad. I. Tradat, Ghazal Mohsenian, Bahgat G. Sammakia, Mark J. Seymour | Numerical Study, Cold Aisle Containments, Small Scale Data Centers, In-Row Cooled Data Centers, Data Center Thermal Management | VIEW | |
Design and Optimization of Hollow Micropillar Structures for Enhanced Evaporative Cooling of High-Powered Electronics | Mun Mun Nahar | Haotian Wu1, Zhikai Yang1, Alexander Austin1, Jorge Padilla2, Madhusudan Iyengar2, Damena Agonafer | Micropillar Structures, Enhanced Evaporative Cooling | VIEW | |
Numerical Investigation of Coolants for Chip-embedded Two-Phase Cooling | Pritish R. Parida | Timothy Chainer | Two-phase cooling, micro pin-fins, thermal modeling, flow boiling. | VIEW | |
Measurement of Performance Characterization of Ultra-Thin Vapor Chamber | Wei-Keng Lin | Wen-Hua Zhang, Chien Huang, Ching-Huang Tsai, Kenny Hsaio | Thermal diffusivity; ultra-thin vapor chamber; heat pipe | VIEW | |
An Analysis of Temperature Variation Effect on Response and Performance of Capacitive Microaccelerometer Inertial Sensors | Jacek Nazdrowicz | Andrzej Napieralski | MEMS, accelerometer, inertial sensor, capacitances | VIEW |
Title | Class | Author | Other Author | Keywords | View Record |
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Dynamic Rack Power Provision to Optimize Rack Power Performance | Heat Sink | Song, Chuan | Jiang, Feng; Liang, Xiaoguo; Zhao, Zheng; Liu, Xingxing; Sun, Yanbing; Ahuja, Nishi; Kumar, Mohan J; Zhou, Xiang; Li, Xiaozhong; Zhang, Lifei | Power Capping, RAPL (Running Average Power limiting), Peak shaving, Battery Backup System(BBS), Dynamic Rack Power Provision (DRPP), Uninterrupted Power System (UPS) | VIEW |
Developing an Empirical Correlation for the Thermal Spreading Resistance of a Heat Sink | Thermal Design | Andrew Werdowatz | Nicole Okamoto and Hussameddine Kabbani | Thermal spreading resistance, heat sink | VIEW |
In Search of a Quiet Fan | Application | David A. Nelson | Richard W. Bonner III | Cooling fan, acoustics, sound power | VIEW |
Using SMT Chip Resistors Beyond Their Rated Thermal Specification | Application | Jeevan Kanesalingam1 | Fabian Kung | Emissivity, thermal camera, derating, SMT Resistor | VIEW |
Thermal Resistance of Electrical Insulation for Bolted and Clamped Discrete Power Devices | Thermal Characterization | Mikel Garcia-Poulin | Mehran Ahmadi, Majid Bahrami, Eric Lau, and Chris Botting | Transistor Mounting, Thermal Measurement, High Voltage | VIEW |
Use of High Conductivity Spreaders on the Back of Single-Sided PCB to Enhance Heat Transfer and Thermal Capacitance in Electronics Systemsnn | Heat Spreader | Joshua Een | Joshua Een | Heat spreader, transient response, steady state | VIEW |
Application of Thermal Network Approach to Electrical-Thermal Co-simulation and Chip-Package-Board Extraction | Simulation Software | Fengyun Zhao | Yuanbin Cai, Zipeng Luo, An-Yu Kuo, Xin Ai, C. T. Kao and Zhemin Zhuang | System level, electrical-thermal, dynamic thermal model | VIEW |
Lightweight and High-Performance Air-Cooled Heat Sinks | Heat Sink | Mohammad Reza Shaeri | Richard W. Bonner III | Heat sink, perforated fin, Pumping power, Thermal resistance | VIEW |
Title | Class | Author | Other Author | Keywords | View Record |
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Analysis of Natural Frequency Dependency on Temperature Variation of MEMS Vibratory Gyroscope | Jacek Nazdrowicz | Andrzej Napieralski | MEMS, vibratory gyroscope, spring constant, damping coefficient, natural frequency, temperature dependency | VIEW | |
Battery Discharge Capacity Calculation by Temperature Measurement | Jeevan Kanesalingam | Khoo Li Lian | Capacity, battery, temperature | VIEW | |
Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling | Binjian Ma | Shan Li, Damena Agonafer, Baris Dogruoz | VIEW | ||
Thermal Performance of Metal Foam Heat Sink with Pin Fins for Non-Uniform Heat Flux Electronics Cooling | Yongtong Li | Liang Gong, Minghai Xu, Yogendra Joshi | Metal foam heat sink, heat transfer, numerical simulation | VIEW | |
A Methodology to Determine the Sites of Variability in an LED Assembly | Robin Bornoff | Thomas Mérelle, Josephine Sari, Alessandro Di Bucchianico, Gabor Farkas | LED, Structure Function, Variation | VIEW | |
Exploring Heatpipe Configurations for Package On Package (PoP) Cooling | Dr. Sankarananda Basak | PoP, PCB, TIM, Heat pipe | VIEW | ||
Transient Analysis Overshoot in Temperature for High Power Thermal Solutions | Javier Avalos | Enrique Barreto | Transient, heat sink, fan speed control | VIEW | |
Simulation-Based Optimization of Data Center Cooling Performance Using Performance Indicators | John Petrongolo | Kourosh Nemati and Kamran Fouladi | VIEW | ||
Implementation of a Multi-domain LED Model and its Application for Optimized LED Luminaire Design | János Hegedüs | Gusztáv Hantos, Robin Bornoff, Márta Rencz, András Poppe | LED mult-domain modelling, compact modelling, SPICE models, spreadsheet application | VIEW | |
The Impact of Anodization on the Thermal Performance of Passively Cooled Electronic Enclosures Made of Die-cast Aluminum | Zhongchen Zhang | Michael Collins, Chris Botting, Eric Lau, Majid Bahrami | Thermal radiation, Natural Convection, Anodization, Electronic cooling | VIEW |
Title | Class | Author | Other Author | Keywords | View Record |
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SOLDER JOINT INTEGRITY EVALUATION OF QFN COMPONENTS WITH VOIDING | Ross Wilcoxon | Tim Pearson, Dave Hillman | Solder Joint, Integrity, Voiding | VIEW | |
Vaporizable Dielectric Fluid Cooling of IGBT Power Semiconductors and Military EV Powertrain Inverters | David L. Saums | IGBT, Dielectric, Vapor | VIEW | ||
Thermal & Hydraulic Performance of Refrigerant Based Two-Phase Cold Plates: Experimental Characterization and System Performance | Alfonso Ortega | Felipe Valenzuela Gaete, Steven Schon | VIEW | ||
Design of Cool Headphones | Guy Wagner | Skin Temperature, Tissue Conductivity | VIEW | ||
Micro-encapsulated phase change materials as heat transfer media in electronics | John D. Rasberry | phase change, heat transfer media | VIEW | ||
ADDITIVELY MANUFACTURED LIQUID COLD PLATE: LESSONS LEARNED | ROSS WILCOXON | ADDITIVE MANUFACTURE, LIQUID COLD PLATE | VIEW | ||
Liquid Cooling System for a 17 kW Artificial Intelligence Module using FloTHERM XT | Guy Wagner | Liquid Cooling, Heat Exchanger, Simulation | VIEW | ||
Thermo-Mechanical Analysis of a Printed Circuit Board | Mehdi Abarham | Multiphysics, Reliability, Structural Analysis | VIEW | ||
Leveraging BCI Reduced Order Models | John Wilson, Electronics Thermal Business Development | Byron Blackmore, Simcenter Flotherm Product Manager | Model, | VIEW | |
Supercritical CO2 Cooling | Alec Nordlund | CO2, | VIEW |
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