38th Annual SEMI-THERM

SEMI-THERM thermal conference is a week full of technical presentations, exhibits, short courses, how to courses, and panel discussions.

All times PDT

Monday

8:00–10:15 AM	Short Course 1: The Role of Intellectual Property in Protecting Semiconductor Innovation Instructors: Neil A. Steinberg, Principal, Patent Strategy Group and Dinesh N. Melwani, Partner, Bookoff McAndrews, PLLC	8:00 AM–12:15 PM	Short Course 3: Thermal Comfort Considerations for Electronics Cooling and Design Instructors: Dr. Mark Hepokoski and Craig Makens
10:15 AM–12:15 PM	Short Course 2a: Fundamentals of Acoustics Instructor: David Nelson
12:15–1:30 PM	Break	12:15–1:30 PM	Break
1:30–3:30 PM	Short Course 2b: Fundamentals of Noise Control Instructor: David Nelson	1:30–5:30 PM	Short Course 4: Photonic and Metamaterial Control of Radiative Heat Transfer Instructor: Aaswath P. Raman
3:30–5:30 PM	Short Course 2c: Example Noise Control Applications Instructor: David Nelson

Tuesday

8:00–8:10 AM	Opening Remarks: Marcelo del Valle, Infinera
8:10–9:10 AM	Track 1: Liquid Cooling Session Session Chair: Marcelo del Valle, Infinera PID 13: Suchismita Sarangi Single-Phase Immersion Cooling Performance in Intel Servers with Immersion Influenced Heatsink Design PID 12: Ty Kieger Computational Analysis of Changing Wavelength and Amplitude Effect on Bottom Rib and Side Rib Wavy Microchannel Heat Sinks PID 4: Dinumol Varghese Parametric study of fluid flow and heat transfer in microchannel heatsink embedded with semi-circular cavities for thermal management of microelectronics chips
9:10–10:10 AM	Keynote: Andy Delano, Microsoft Corporation Innovations in Thermal Management of Electronic Devices
10:10–10:30 AM	Break
10:30 AM–12:30 PM	Track 2: Current Topics in Thermal Management Session Chair: Lieven Vervecken, Diabatix nv Shahar Belkin, ZutaCore Advantages of Two-phase, Pool-boiling, Cold-plate Evaporator: Based on a Unique Structure of Fins and Wick Al Ortega, Villanova Univ. Identifying Performance Limits for Single Phase Liquid Cooled Cold Plates using an Improved Effectiveness-NTU Model Dave Saums, DS&A LLC CTE-Matched Thermal Composites: Overview and Update Sujay Singh, Onsemi Transient Methods to Shorten Time Thermal Measurements
12:30–1:50 PM	Luncheon Speaker Dave Saums, DS&A LLC
1:50–2:00 PM	Break
2:00–3:00 PM	Vendor Workshops 1: Siemens/Indium
3:00–4:00 PM	Vendor Workshops 2: Ansys/ZutaCore
4:00–5:00 PM	Vendor Workshops 3: Fujipoly
5:00–6:00 PM	How To: Leakage Current in Thermal Design Presenter: Rajat Mittal, Meta
6:00–7:15 PM	Dinner
7:30–9:00 PM	Maximizing Early Career Trajectory Panel Jim Wilson - Moderator Ross Wilcoxon, Al Ortega, Adriana Rangel, Clair Wemp

Wednesday

8:00–8:10 AM	Opening Remarks: Jim Wilson, Raytheon
8:10–9:10 AM	Thermi Award Presentation Dr. Sreekant Narumanchi, National Renewable Energy Laboratory Advanced Power electronics and Electric Machines for Electric-Drive Mobility Applications
9:10–10:10 AM	Track 3: Two-Phase Cooling Session Chair: George Meyer, Celsia, Inc. PID 2: Sangmuk Kwark Evaluation of Cooling Capacity of Refrigeration System with Limited Charge of R-290 PID 23: Lieven Vervecken Generative design and experimental validation of a two-phase heat sink PID 19: Najmeh Fallahtafti Comparison of Two Designs of an Impingement Two-phase Cooling Cold Plate Intended for High Heat Flux in Data Center
10:10–10:30 AM	Break
10:30 AM–12:30 PM	Track 4: TIM Session Chair: Jason Strader PID 6: Xuefeng Lin Optimized Dispensing of Thermal Interface Materials: Issues and Progress PID 8: Claire K Wemp Measuring Change in Thermal Performance of Multi-layer Laminates after Reliability Testing PID 17: Andras Vass-Varnai Characterization of Thermal Interface Materials for Power Electronics Applications PID 5: Jungho Lee Thermal Management Device with Boiling Driven Heat Spreader PID 9: Robin Bornoff Application of JESD51-14 to BGS Package Styles Milos Lazic Indium Liquid Hybrid Metal TIMS
12:30–1:50 PM	Luncheon Speaker Lieven Vervecken, Diabatix
1:50–2:00 PM	Break
2:00–3:00 PM	Vendor Workshops 4: Siemens/CPC
3:00–4:00 PM	Vendor Workshops 5: Future Facilities/Cool IT
4:00–5:30 PM
5:30–6:30 PM	Exhibit Reception

Thursday

8:00–8:10 AM	Opening Remarks: Ross Wilcoxon, Collins Aerospace
8:10–9:10 AM	Track 5: Data Center Session Chair: Rick Eiland PID 3: Javier Avalos Garcia Intel Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results PID 24: Vibin Shalom Simon Characterization of parallel and opposed control dampers to observe the effect on thermal mixing of air streams in an air-cooling unit PID 11: Rich Ewy Subzero System Heating for Outdoor Applications
9:10–10:10 AM	Embedded Tutorial: Mark Wisniewski, Laird Designing Thermal Interface Materials for Manufacturability and Ease of Use
10:10–10:30 AM	Break
10:30 AM–12:30 PM	Track 6: Emerging Technologies Session Chair: Dave Saums, DS&A LLC. PID 16: Vito Di Pietro Manufacturing of Integrated Thermal Management Solutions Using Friction Stir Channelling Derived Process CoreFlow™ PID 20: Ross Wilcoxon Oscillating Heat Pipe Thermal Performance and Stability Limits PID 22: Azita Soleymani Thermal and Hydraulic Characterization of a Double-sided Cold Plate Used in AI Systems PID 10: Burhan Ozmat Infiltrated Metal Foam Based Advanced Passive Heat Exchangers
11:50 AM–12:30 PM	Thermal Hall of Fame recipient presentation Dave Saums, DS&A LLC
12:30–1:50 PM	Awards Luncheon Alex Ockfen, Facebook and Marcelo del Valle, Infinera
1:50–3:00 PM
3:00–4:00 PM	TAB Meeting
4:00–5:00 PM	STEF BOD Meeting
5:00–6:15 PM
6:15–7:15 PM	Post ST committee meeting

Short Courses

These two-hour classes provide practical, interactive training on a variety of specific skills on topics ranging from thermal design & modeling to system level validation testing. Some are designed for those who are relatively new to thermal management. As such, they focus on basic concepts and techniques. Other classes are meant for seasoned thermal engineers wanting to gain deeper insight into best-in-class tools and practices. Attendees can choose one Short Course in the morning and one in the afternoon.

Technical Sessions

Each Technical Session typically includes 3 brief presentations (15 minutes plus a 5 minute Q&A) summarizing the design, tests, and findings of research and development efforts. Topics include any thermally related challenge or solution from the die to the facility level. Presentations are generally based on peer reviewed academic research but may also be private sector R&D professionals working alone or as part of an inter-agency program. With over 20 presentations scheduled for the symposium, attendees should expect to have a solid overview of the latest developments in thermal management.

Vendor Workshops

SEMI-THERM exhibitors offer a technical overview of a specific product during these 30 minute presentations. Scheduled throughout the symposium, presenters generally focus on the technical aspects of product selection, implementation and usage that are discussed as part of an engineering system / component discovery effort.

Vendor Exhibits

Be sure to spend some technical face time with the 20+ exhibitors that are available throughout the event to demonstrate and explain their products and services.