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38th Annual SEMI-THERM

SEMI-THERM thermal conference is a week full of technical presentations, exhibits, short courses, how to courses, and panel discussions.

All times PDT

8:00–10:15 AMShort Course 1: The Role of Intellectual Property in Protecting Semiconductor Innovation
Instructors: Neil A. Steinberg, Principal, Patent Strategy Group and Dinesh N. Melwani, Partner, Bookoff McAndrews, PLLC
8:00 AM–12:15 PMShort Course 3: Thermal Comfort Considerations for Electronics Cooling and Design
Instructors: Dr. Mark Hepokoski and Craig Makens
10:15 AM–12:15 PMShort Course 2a: Fundamentals of Acoustics
Instructor: David Nelson
12:15–1:30 PMBreak12:15–1:30 PMBreak
1:30–3:30 PMShort Course 2b: Fundamentals of Noise Control
Instructor: David Nelson
1:30–5:30 PMShort Course 4: Photonic and Metamaterial Control of Radiative Heat Transfer
Instructor: Aaswath P. Raman
3:30–5:30 PMShort Course 2c: Example Noise Control Applications
Instructor: David Nelson
8:00–8:10 AMOpening Remarks: Marcelo del Valle, Infinera
8:10–9:10 AMTrack 1: Liquid Cooling Session
Session Chair: Marcelo del Valle, Infinera

PID 13: Suchismita Sarangi
Single-Phase Immersion Cooling Performance in Intel Servers with Immersion Influenced Heatsink Design

PID 12: Ty Kieger
Computational Analysis of Changing Wavelength and Amplitude Effect on Bottom Rib and Side Rib Wavy Microchannel Heat Sinks

PID 4: Dinumol Varghese
Parametric study of fluid flow and heat transfer in microchannel heatsink embedded with semi-circular cavities for thermal management of microelectronics chips
9:10–10:10 AM
Keynote: Andy Delano, Microsoft Corporation
Innovations in Thermal Management of Electronic Devices
10:10–10:30 AMBreak
10:30 AM–12:30 PM
Track 2: Current Topics in Thermal Management
Session Chair: Lieven Vervecken, Diabatix nv

Shahar Belkin, ZutaCore
Advantages of Two-phase, Pool-boiling, Cold-plate Evaporator: Based on a Unique Structure of Fins and Wick

Al Ortega, Villanova Univ.
Identifying Performance Limits for Single Phase Liquid Cooled Cold Plates using an Improved Effectiveness-NTU Model

Dave Saums, DS&A LLC
CTE-Matched Thermal Composites: Overview and Update

Sujay Singh, Onsemi
Transient Methods to Shorten Time Thermal Measurements
12:30–1:50 PMLuncheon Speaker
Dave Saums, DS&A LLC
1:50–2:00 PMBreak
2:00–3:00 PMVendor Workshops 1: Siemens/Indium
3:00–4:00 PMVendor Workshops 2: Ansys/ZutaCore
4:00–5:00 PMVendor Workshops 3: Fujipoly
5:00–6:00 PMHow To: Leakage Current in Thermal Design
Presenter: Rajat Mittal, Meta
6:00–7:15 PMDinner
7:30–9:00 PMMaximizing Early Career Trajectory Panel
Jim Wilson - Moderator
Ross Wilcoxon, Al Ortega, Adriana Rangel, Clair Wemp
8:00–8:10 AMOpening Remarks: Jim Wilson, Raytheon
8:10–9:10 AMThermi Award Presentation
Dr. Sreekant Narumanchi, National Renewable Energy Laboratory
Advanced Power electronics and Electric Machines for Electric-Drive Mobility Applications
9:10–10:10 AMTrack 3: Two-Phase Cooling
Session Chair: George Meyer, Celsia, Inc.

PID 2: Sangmuk Kwark
Evaluation of Cooling Capacity of Refrigeration System with Limited Charge of R-290

PID 23: Lieven Vervecken
Generative design and experimental validation of a two-phase heat sink

PID 19: Najmeh Fallahtafti
Comparison of Two Designs of an Impingement Two-phase Cooling Cold Plate Intended for High Heat Flux in Data Center
10:10–10:30 AMBreak
10:30 AM–12:30 PMTrack 4: TIM
Session Chair: Jason Strader

PID 6: Xuefeng Lin
Optimized Dispensing of Thermal Interface Materials: Issues and Progress

PID 8: Claire K Wemp
Measuring Change in Thermal Performance of Multi-layer Laminates after Reliability Testing

PID 17: Andras Vass-Varnai
Characterization of Thermal Interface Materials for Power Electronics Applications

PID 5: Jungho Lee
Thermal Management Device with Boiling Driven Heat Spreader

PID 9: Robin Bornoff
Application of JESD51-14 to BGS Package Styles

Milos Lazic
Indium Liquid Hybrid Metal TIMS
12:30–1:50 PMLuncheon Speaker
Lieven Vervecken, Diabatix
1:50–2:00 PMBreak
2:00–3:00 PMVendor Workshops 4: Siemens/CPC
3:00–4:00 PMVendor Workshops 5: Future Facilities/Cool IT
4:00–5:30 PM
5:30–6:30 PMExhibit Reception
8:00–8:10 AMOpening Remarks: Ross Wilcoxon, Collins Aerospace
8:10–9:10 AMTrack 5: Data Center
Session Chair: Rick Eiland

PID 3: Javier Avalos Garcia
Intel Air Cooling Server Conversion to Two Phase Immersion Cooling and Thermal Performance Results

PID 24: Vibin Shalom Simon
Characterization of parallel and opposed control dampers to observe the effect on thermal mixing of air streams in an air-cooling unit

PID 11: Rich Ewy
Subzero System Heating for Outdoor Applications
9:10–10:10 AMEmbedded Tutorial: Mark Wisniewski, Laird
Designing Thermal Interface Materials for Manufacturability and Ease of Use
10:10–10:30 AMBreak
10:30 AM–12:30 PMTrack 6: Emerging Technologies
Session Chair: Dave Saums, DS&A LLC.

PID 16: Vito Di Pietro
Manufacturing of Integrated Thermal Management Solutions Using Friction Stir Channelling Derived Process CoreFlow™

PID 20: Ross Wilcoxon
Oscillating Heat Pipe Thermal Performance and Stability Limits

PID 22: Azita Soleymani
Thermal and Hydraulic Characterization of a Double-sided Cold Plate Used in AI Systems

PID 10: Burhan Ozmat
Infiltrated Metal Foam Based Advanced Passive Heat Exchangers
11:50 AM–12:30 PMThermal Hall of Fame recipient presentation
Dave Saums, DS&A LLC
12:30–1:50 PMAwards Luncheon
Alex Ockfen, Facebook and Marcelo del Valle, Infinera
1:50–3:00 PM
3:00–4:00 PMTAB Meeting
4:00–5:00 PMSTEF BOD Meeting
5:00–6:15 PM
6:15–7:15 PMPost ST committee meeting

Short Courses

These two-hour classes provide practical, interactive training on a variety of specific skills on topics ranging from thermal design & modeling to system level validation testing. Some are designed for those who are relatively new to thermal management. As such, they focus on basic concepts and techniques. Other classes are meant for seasoned thermal engineers wanting to gain deeper insight into best-in-class tools and practices. Attendees can choose one Short Course in the morning and one in the afternoon.

Technical Sessions 

Each Technical Session typically includes 3 brief presentations (15 minutes plus a 5 minute Q&A) summarizing the design, tests, and findings of research and development efforts. Topics include any thermally related challenge or solution from the die to the facility level. Presentations are generally based on peer reviewed academic research but may also be private sector R&D professionals working alone or as part of an inter-agency program. With over 20 presentations scheduled for the symposium, attendees should expect to have a solid overview of the latest developments in thermal management.

Vendor Workshops

SEMI-THERM exhibitors offer a technical overview of a specific product during these 30 minute presentations. Scheduled throughout the symposium, presenters generally focus on the technical aspects of product selection, implementation and usage that are discussed as part of an engineering system / component discovery effort.

Vendor Exhibits

Be sure to spend some technical face time with the 20+ exhibitors that are available throughout the event to demonstrate and explain their products and services.

Keynote Speaker


Thermi Award Presentation


Embedded Tutorial


Hall of Fame Award Presentation


Event Description
Final Program
Short Courses