These four-hour classes provide practical, interactive training on a variety of specific skills on topics ranging from thermal design & modeling to system level validation testing. Some are designed for those who are relatively new to thermal management. As such, they focus on basic concepts and techniques. Other classes are meant for seasoned thermal engineers wanting to gain deeper insight into best-in-class tools and practices. Attendees can choose one Short Course in the morning and one in the afternoon.
|Monday, March 13, 2023
|8:00 AM–12:00 PM||
Short Course I - Fundamentals of CFD for Heat Transfer Analysis: Governing Equations, Numerical Methods, and Applications
Instructors: Ine Vandebeek, Head of R&D, Diabatix and Dr. Lieven Vervecken, CEO, Diabatix
Short Course II - Understanding, Applying and Estimating the Performance of Advanced Two-phase Heat Pipe Systems
Instructors: Olivier de Laet, Founder, Calyos SA and Vincent Dupont, CTO, Calyos SA
Short Course III - Addressing Chip Component Thermal and Reliability Challenges for Qualification of Liquid-Cooled Compute System for Autonomous Driving
Instructors: Fen Chen, Principal Reliability Engineer, Cruise LLC and Xiaojin Wei, Rivian
Short Course IV - Direct to Chip Liquid Cooling: Single Phase Water Versus Pumped Two- Phase Refrigerant Cooling
Instructor: Alfonso Ortega, Birle Endowed Chair Professor of Energy Technology, Villanova University
Short Course V - Transient Thermal Analysis Using Linear Superposition
Instructor: Roger Stout, Professional Engineer (Retired)
Each Technical Session typically includes 3 brief presentations (15 minutes plus a 5 minute Q&A) summarizing the design, tests, and findings of research and development efforts. Topics include any thermally related challenge or solution from the die to the facility level. Presentations are generally based on peer reviewed academic research but may also be private sector R&D professionals working alone or as part of an inter-agency program. With over 20 presentations scheduled for the symposium, attendees should expect to have a solid overview of the latest developments in thermal management.
Dupont Silicon Valley Technology Center
Monday, March 13, 6:00-9:00PM
The DuPont Silicon Valley Technology Center (SVTC) is a dynamic hub housing 10 state of the art applied engineering labs and a vibrant Innovation Center. DuPont’s immersive facility is designed to show visitors the full scope of their expertise and capabilities, and to highlight their local and global network of scientists, chemists and engineers, SEMI-THERM visitors will hear from SVTC engineers about the intersection of thermal management and RF technology and engage in a discussion about this exciting topic. They will also tour the application lab facilities and learn about the most critical tests being run to characterize DuPont’s reliable and high performance materials for customers across the world. Come and see how DuPont is creating the essential innovations that the world needs now!
Transportation and refreshments will be provided.
Attendance limited to SEMI-THERM Full Program attendees and speakers.
“Thermal Management to Enable Future Trends in HSHF”
When we talk about thermal management in technology spaces such as data centers and automotive, we often focus on the components that produce the most heat. Components like high-power processors and power converters and batteries are tackled with innovative thermal management technologies. However, many of these same technology spaces are also pushing the bounds of high-speed high-frequency (HSHF) communication. The materials for these HSHF applications have many electrical properties that are critical to their success, but it’s also important to understand how temperature plays a role in the performance of these materials. This presentation will provide a technical understanding of the interdependencies between thermal and HSHF using practical examples and presenting analytical data which can be used to better understand the needs in this space. Only then can we open up a conversation to the critical need to thermally manage these components for optimal performance, which will allow for continued advancement of HSHF technologies in a variety of growing market spaces.
Friday, March 17, 2023: JC15 Standard Meeting
Thermal Workshop – Development of Thermal Characterization Standards for Electronic Industry
Technical standards are an essential component for building commonality for the exchange of information between suppliers and users of electronic components. The JC15 thermal standards committee develops thermal characterization techniques for semiconductor packages by following a set of principles including; shall be meaningful, consistent, and shall be proven to be scientifically sound. From the first standards developed in the 1990s, addressing experimental methods for single die packages, to more recent standards addressing the provision of neutral file format thermal models, the JC15 committee has provided the guidance on thermal characterization best practices.
This open thermal workshop will provide a will provide a historical view of standards develop over the past 30 years and an assessment of future needs as electronic package characterization become more complex including multi- die operating under transient conditions. With simulation needs in mind, two areas will be discussed in more detail. The first topic is boundary condition independent thermal modeling considerations. The second topic is the importance of local power maps on device reliability measurements and thermal predictions. Please join us in discussing the ever-growing need for thermal standards to characterize more complex electronic packages.
|Morning Session - Thermal Workshop
|8:00–8:30 AM||Coffee and introduction
|8:30–9:30||Standardization in electronics industry: yesterday, today, tomorrow
|9:30–10:45||Boundary Condition Independent Thermal Modeling Considerations
|11:00 AM–12:00 PM||Importance of local power maps on device reliability measurements and thermal predictions
|12:00–12:30||How good is that thermal measurement? – statistics and implications?
|Afternoon Session – JEDEC Member ballot discussion – JEDEC Members Only
|2:00–2:15 PM||Welcome/roll call
|2:15–2:45||Mechanics of submitting a ballot (Jesse)
|2:45–3:15||Theta jc standard round-robin (Jesse Galloway)
|3:15–4:00||Updates on standards → What was passed, open activity, under consideration?
|4:30–4:45||Ballot initiatives → making a motion to submit ballot to voting machine
|4:45–5:00||Next meeting planning and closing remarks
SEMI-THERM exhibitors offer a technical overview of a specific product during these 30 minute presentations. Scheduled throughout the symposium, presenters generally focus on the technical aspects of product selection, implementation and usage that are discussed as part of an engineering system / component discovery effort.
Be sure to spend some technical face time with the 20+ exhibitors that are available throughout the event to demonstrate and explain their products and services.
Thermi Award Presentation
Wednesday, March 15, 4:00–5:00 PM
A Look at Acoustic Fundamentals and Designs as Applied to Air-Cooled Electronics
Presenter: Herman Chu
As air-cooling design continues to increase in airflow requirement without much relieve in the overall equipment form factor, acoustic design considerations need to be actively engaged at the start of the product development cycle in order to clearly define expectations and deliver the best achievable sound quality.
In this how-to session, the speaker will present acoustic design fundamentals, review logarithmic arithmetic used in calculating sound levels, and review pertinent industry standards in performing acoustic testing for product evaluation.
Herman Chu is classically trained in thermal fluid systems and has over 30 years of industry experience spanning from military aerospace applications to electronic cooling of consumer products, computers and computer servers, mainframes and NEBS compliant networking equipment. His career has taken him to deploy all different kinds of cooling technologies from air cooling to various forms of liquid cooling.
His latest accomplishment is architecting the first active 2-Phase cooling for a commercial deskside AI supercomputer.
Hall of Fame Award Presentation
Harvey Rosten Award