Detailed Agenda

SEMI-THERM thermal conference is a week full of technical presentations, exhibits, short courses, how to courses, and panel discussions.

Short Courses

These four-hour classes provide practical, interactive training on a variety of specific skills on topics ranging from thermal design & modeling to system level validation testing. Some are designed for those who are relatively new to thermal management. As such, they focus on basic concepts and techniques. Other classes are meant for seasoned thermal engineers wanting to gain deeper insight into best-in-class tools and practices. Attendees can choose one Short Course in the morning and one in the afternoon.

Monday, March 13, 2023
8:00 AM–12:00 PM

Short Course I - Fundamentals of CFD for Heat Transfer Analysis: Governing Equations, Numerical Methods, and Applications
Instructors: Ine Vandebeek, Head of R&D, Diabatix and Dr. Lieven Vervecken, CEO, Diabatix


Short Course II - Understanding, Applying and Estimating the Performance of Advanced Two-phase Heat Pipe Systems
Instructors: Olivier de Laet, Founder, Calyos SA and Vincent Dupont, CTO, Calyos SA


Short Course III - Addressing Chip Component Thermal and Reliability Challenges for Qualification of Liquid-Cooled Compute System for Autonomous Driving
Instructors: Fen Chen, Principal Reliability Engineer, Cruise LLC and Xiaojin Wei, Rivian
1:30–5:30 PM

Short Course IV - Direct to Chip Liquid Cooling: Single Phase Water Versus Pumped Two- Phase Refrigerant Cooling
Instructor: Alfonso Ortega, Birle Endowed Chair Professor of Energy Technology, Villanova University


Short Course V - Transient Thermal Analysis Using Linear Superposition
Instructor: Roger Stout, Professional Engineer (Retired)

Technical Sessions 

Each Technical Session typically includes 3 brief presentations (15 minutes plus a 5 minute Q&A) summarizing the design, tests, and findings of research and development efforts. Topics include any thermally related challenge or solution from the die to the facility level. Presentations are generally based on peer reviewed academic research but may also be private sector R&D professionals working alone or as part of an inter-agency program. With over 20 presentations scheduled for the symposium, attendees should expect to have a solid overview of the latest developments in thermal management.

8:00–8:10 AMOpening Remarks
8:10–9:10 AMSession 1 - Comfort and Compliance, Session Chair: Mark Hepokoski, ThermoAnalytics

  • 1.1 Reduced-Order Modeling for Thermal Dose Forecasting in Wearable Devices; Harry Watson, Exponent

  • 1.2 Evaluation of Thermal Injury Level in the Event of Smartwatch Battery Failure; Mark Hepokoski, ThermoAnalytics, Inc.

  • 1.3 Development of a Human Surrogate Measurement Device for Testing Infants Undergoing Therapeutic Hypothermia; Robert Shea, Belmont Medical Technologies
9:10–10:10 AMKeynote Address - Ashish Gupta, Intel
10:10–10:30 AMBreak
10:30–11:30 AMSession 2 - Two Phase I, Session Chair: Dave Saums, DS&A LLC

  • 2.1 Experimental Comparison on Thermal Performance of Pulsating Heat Pipe and Embedded Heat Spreaders; Sai Kiran Hota, Advanced Cooling Technologies

  • 2.2 Controlling Flow Instabilities in Direct-to-Chip Two-Phase Cooling for High Heat Flux Processors; Yaman Manaserh, NVIDIA

  • 2.3 Flow Boiling Heat Transfer Performance Comparison of Skived Straight and CNC Diverging Microchannels Heat Sinks; Chien-Yuh Yang, National Central University, Taiwan
10:30–11:30 AMSession 3 - Advanced Manufacturing & Materials, Session Chair: Jason Jones, Hybrid Manufacturing Technologies

  • 3.1 Experimental Performance of Supercritical Carbon Dioxide within Cold Plates made with Additive Manufacturing Techniques; Wyatt Stottlemyre, Oregon State University

  • 3.2 Assessing the performance of liquid cooled plates for inverter stacks produced by CoreFlow(TM); Jason Jones, TWI Ltd.

  • 3.3 Is the Copper 3D Printing Technology Ready to Compete with Skived Heat Sinks?; Suraj Dinkar Jadhav, Amnovis BV

  • 3.4 Generative Design and Experimental Validation of a CPU Cooler AI-Backed 3D Copper Design; Lieven Vervecken, Diabatix nv
11:30 AM–12:30 PMSession 4 - Two Phase II, Session Chair: Dave Saums, DS&A LLC

  • 4.1 Thermal Performance of Wickless Boiling-Driven Heat Spreader; Jungho Lee, Ajou University, ROK

  • 4.2 Dielectric Oscillating Heat Pipe Development for Printed Circuit Board Ground Plane, High Power Amplifier, and Radio Frequency Systems; Patrick Margavio, ThermAvant Technologies

  • 4.3 A Loop Heat Pipe for Vehicle CPU Cooling: Peak Performance, Partial Flooding and Dryout Regimes; Olivier de Laet, Calyos SA
11:30 AM–12:30 PMSession 5 - Emerging Technology, Session Chair: Sai Kiran Hota, Advanced Cooling Technologies
  • 5.1 Evaluation of CVD diamond Heat-Spreaders for use with High Frequency MMICs; Firooz Faili, Element Six Technologies, USA

  • 5.2 Soft and Stretchable Composite Materials for Wearable Thermoelectric Body Thermoregulation and Energy Harvesting; Mason Zadan, Carnegie Mellon University

  • 5.3 Solid-State Portable Coolers and Warmers using Thermoelectric Systems; Brandon Noska, Sheetak, Inc

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    12:30–1:50 PMLuncheon: High-Tech in High Heels, Katrien Herdewijn
    1:30–6:30 PMVendor Exhibits
    2:00–5:00 PMVendor Workshops
    5:00–6:00 PMPanel Discussion: Maximizing Early Career Trajectory

    The Career Trajectory panelists will share their insight on how to build a successful career in the electronics cooling industry. Each panelist will be asked to address the question: “What do you know now that you wish you had been told when you started your career?” The goals of these presentations are to inform, entertain and stimulate active discussion with the attendees.
    6:30–7:00 PMDinner
    8:00–8:10 AMOpening Remarks
    8:10–9:10 AMSession 6 – Immersion, Session Chair: Dave Saums, DS&A LLC

    • 6.1 Thermal Interface Materials in Liquid Immersion for Computing and Power Electronics; Dave Saums, DS&A LLC

    • 6.2 Understanding Boiling Crisis using High-Speed Measurements of Temperature and Phase Distribution to Enable High-Power-Density Immersion Cooled Electronics; Justin A. Weibel, Purdue University

    • 6.3 Air vs. Single-Phase Immersion Cooling; Guy Wagner, Electronic Cooling Solutions Inc.

    • 6.4 Exploration of Boiling Enhancement Coating Designs in High-Power Chip/Server Cooling using Two-Phase Immersion Cooling Technique; Vaidehi Oruganti, Microsoft
    9:10–10:10 AMThermi Award Recipient Presentation
    10:10–10:30 AMBreak
    10:30–11:30 AMSession 7 - Testing & Measurement Methods I, Session Chair: Mohamad Abo Ras, Berliner Nanotest und Design GmbH

    • 7.1 The Validity of JESD51-14 for Differing Package Styles; Robin Bornoff, Siemens

    • 7.2 Subpixel Cross Correlation Registration for High Spatial Resolution Thermal Image on IGBT Emitter Metallization by Thermoreflectance Measurements; Thierry Kociniewski, Groupe d’Etude de la Matière Condensée, CNRS and University of Versailles St Quentin

    • 7.3 Thermal Test Vehicles for Evaluation and Qualification of Advanced Packages; Mohamad Abo Ras, Berliner Nanotest und Design GmbH
    10:30–11:30 AMSession 8 – TIMS I, Session Chair: Philip Marzolf, Arieca Inc.

    • 8.1 Thermal Conductivity is NOT the Only Deciding Factor: A Guide to Understanding Unaddressed Challenges with Liquid Metals TIMs; Claire Wemp and John Hodul, DuPont

    • 8.2 Liquid Metal Embedded Elastomers as TIM2 Materials; Dylan Shah, Arieca, Inc.

    • 8.3 Innovative Next Generation Metal TIM Technology for HPC Applications; Timothy Jensen, Indium Corporation

    • 8.4 Metal Gel Material: A Novel Liquid Metal Paste for Thermal Management Applications; Taylor Neumann, Liquid Wire
    11:30 AM–12:30 PMSession 9 - Testing & Measurement Methods II, Session Chair: Mohamad Abo Ras, Berliner Nanotest und Design GmbH

    • 9.1 Measurement of the Effective Thermal Diffusion Conductivity of Vapor Chamber; Professor Wei-Keng Lin, T-Global Technology Co., Ltd

    • 9.2 A De-embedded Pressure Drop Measurement Technique Coupled with Flow Network Analysis Software to Evaluate Pressure Drop Performance Curves for Direct Liquid Cooling Thermal Management Applications; Stephen Polzer, Mayo Clinic

    • 9.3 Study of Temperature Measurement Accuracy by Using Different Mounting Adhesives on Plastics; Dr. Jeevan Kanesalingam, Motorola Solutions

    • 9.4 Fractional Thermal Runaway Calorimetry: A Novel Tool to Assess Battery Thermal Runaway Energy; May Yen, Exponent
    11:30 AM–12:30 PMSession 10 - TIMS II, Session Chair: Navid Kazem, Arieca Inc.

    • 10.1 A New Generation of Thermal Interface Materials; Rafael Padilla, Boston Materials

    • 10.2 Aging Investigations Under Mechanical Stress on Thermal Interface Materials; Antonio Harder, Berliner Nanotest und Design GmbH
    12:30–1:50 PMLuncheon: Jousef Murad, Host of the Engineering Mind Podcast
    1:50–2:00 PMBreak
    1:30–6:30 PMVendor Exhibits
    2:00–5:00 PMVendor Workshops
    5:15–6:30 PMExhibit Reception
    8:00–8:10 AMOpening Remarks
    8:10–10:10 AMSession 11 - Data Centers, Session Chair: Jason Strader, Laird

    • 11.1 Impact of Rack Thermal Management Architecture on Data Center Energy Consumption; Tim Shedd, Dell Technologies

    • 11.2 Performance Comparison of Five Data Center Server Thermal Management Technologies; Tim Shedd, Dell Technologies

    • 11.3 Corrosion: A Localized Problem with Broad Impact - A Case Study on Surface Characterization of Eroded Metal Plating via Elemental Analysis; Andres Abraham, Colder Products Company

    • 11.4 A Transient CFD Study on Implementation of Dynamic Liquid Cooling for Series and Parallel Arrangement of Components in a Server at Rack Level; Himanshu Modi, The University of Texas At Arlington

    • 11.5 Coolant Considerations for Liquid Cooling; Albert Chan, Cisco Systems, Inc.

    • 11.6 Air-Immersion Solution, Maximizing Data Centers Heat Reuse, Using Hybrid Cooling Approach Combining Two-Phase Direct on Chip Dielectric Liquid and Air-Based Chip Cooling; Shahar Belkin, ZutaCore
    10:10–10:30 AMBreak
    10:30–11:30 AMSession 12 - Numerical Modeling Methods, Session Chair: Menasa Sahini, Meta

    • 12.1 Evaluation of Embeddable FANTASTIC BCI-ROMs as Compact Thermal Models; Mahmood Alkhenaizi, Siemens Digital Industry

    • 12.2 Transient Thermal Control Simulation and Analysis Using Reduced Order Modeling of An Automotive Package Test System; Christopher W Argento, NXP Semiconductors

    • 12.3 Thermal Analysis and Optimization of Electric Vehicle Power Control Unit; Anup Paul, Hexagon Manufacturing Intelligence
    11:30 AM–12:30 PMHall of Fame Talk: Alfonso Ortega, Alfonso Ortega, Birle Endowed Chair Professor of Energy Technology, Villanova University
    12:30–1:30 PMLuncheon: SEMI-THERM Awards

    Facility Tour:
    Dupont Silicon Valley Technology Center
    Monday, March 13, 6:00-9:00PM

    The DuPont Silicon Valley Technology Center (SVTC) is a dynamic hub housing 10 state of the art applied engineering labs and a vibrant Innovation Center. DuPont’s immersive facility is designed to show visitors the full scope of their expertise and capabilities, and to highlight their local and global network of scientists, chemists and engineers, SEMI-THERM visitors will hear from SVTC engineers about the intersection of thermal management and RF technology and engage in a discussion about this exciting topic. They will also tour the application lab facilities and learn about the most critical tests being run to characterize DuPont’s reliable and high performance materials for customers across the world. Come and see how DuPont is creating the essential innovations that the world needs now!

    Transportation and refreshments will be provided.

    Attendance limited to SEMI-THERM Full Program attendees and speakers.

    “Thermal Management to Enable Future Trends in HSHF”

    ABSTRACT:
    When we talk about thermal management in technology spaces such as data centers and automotive, we often focus on the components that produce the most heat. Components like high-power processors and power converters and batteries are tackled with innovative thermal management technologies. However, many of these same technology spaces are also pushing the bounds of high-speed high-frequency (HSHF) communication. The materials for these HSHF applications have many electrical properties that are critical to their success, but it’s also important to understand how temperature plays a role in the performance of these materials. This presentation will provide a technical understanding of the interdependencies between thermal and HSHF using practical examples and presenting analytical data which can be used to better understand the needs in this space. Only then can we open up a conversation to the critical need to thermally manage these components for optimal performance, which will allow for continued advancement of HSHF technologies in a variety of growing market spaces.

    Friday, March 17, 2023: JC15 Standard Meeting

    Thermal Workshop – Development of Thermal Characterization Standards for Electronic Industry

    Technical standards are an essential component for building commonality for the exchange of information between suppliers and users of electronic components. The JC15 thermal standards committee develops thermal characterization techniques for semiconductor packages by following a set of principles including; shall be meaningful, consistent, and shall be proven to be scientifically sound. From the first standards developed in the 1990s, addressing experimental methods for single die packages, to more recent standards addressing the provision of neutral file format thermal models, the JC15 committee has provided the guidance on thermal characterization best practices.

    This open thermal workshop will provide a will provide a historical view of standards develop over the past 30 years and an assessment of future needs as electronic package characterization become more complex including multi- die operating under transient conditions. With simulation needs in mind, two areas will be discussed in more detail. The first topic is boundary condition independent thermal modeling considerations. The second topic is the importance of local power maps on device reliability measurements and thermal predictions. Please join us in discussing the ever-growing need for thermal standards to characterize more complex electronic packages.

    Morning Session - Thermal Workshop
    8:00–8:30 AMCoffee and introduction
    8:30–9:30Standardization in electronics industry: yesterday, today, tomorrow
    9:30–10:45Boundary Condition Independent Thermal Modeling Considerations
    10:45–11:00Break
    11:00 AM–12:00 PMImportance of local power maps on device reliability measurements and thermal predictions
    12:00–12:30How good is that thermal measurement? – statistics and implications?
    Afternoon Session – JEDEC Member ballot discussion – JEDEC Members Only
    2:00–2:15 PMWelcome/roll call
    2:15–2:45Mechanics of submitting a ballot (Jesse)
    2:45–3:15Theta jc standard round-robin (Jesse Galloway)
    3:15–4:00Updates on standards → What was passed, open activity, under consideration?
    4:00–4:30Task groups
    4:30–4:45Ballot initiatives → making a motion to submit ballot to voting machine
    4:45–5:00Next meeting planning and closing remarks

    Vendor Workshops

    SEMI-THERM exhibitors offer a technical overview of a specific product during these 30 minute presentations. Scheduled throughout the symposium, presenters generally focus on the technical aspects of product selection, implementation and usage that are discussed as part of an engineering system / component discovery effort.

    Vendor Exhibits

    Be sure to spend some technical face time with the 20+ exhibitors that are available throughout the event to demonstrate and explain their products and services.

    Keynote Speaker

    TBD

    Thermi Award Presentation

    TBD

    How-To Presentation

    Wednesday, March 15, 4:00–5:00 PM

    A Look at Acoustic Fundamentals and Designs as Applied to Air-Cooled Electronics
    Presenter: Herman Chu

    As air-cooling design continues to increase in airflow requirement without much relieve in the overall equipment form factor, acoustic design considerations need to be actively engaged at the start of the product development cycle in order to clearly define expectations and deliver the best achievable sound quality.

    In this how-to session, the speaker will present acoustic design fundamentals, review logarithmic arithmetic used in calculating sound levels, and review pertinent industry standards in performing acoustic testing for product evaluation.

    Herman Chu is classically trained in thermal fluid systems and has over 30 years of industry experience spanning from military aerospace applications to electronic cooling of consumer products, computers and computer servers, mainframes and NEBS compliant networking equipment. His career has taken him to deploy all different kinds of cooling technologies from air cooling to various forms of liquid cooling.
    His latest accomplishment is architecting the first active 2-Phase cooling for a commercial deskside AI supercomputer.

    Hall of Fame Award Presentation

    Harvey Rosten Award

    Event Description
    Final Program
    Short Courses