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High Performance Lightweight Ceramic Material for Thermal Management in Electronic Devices Bei Xiang Chandra Raman and Xiang Liu VIEW
Performance of Durable High-Performance Polymer Composite TIMs Under Accelerated Aging Conditions Hyungyung Jo John Howarter VIEW
Research on Package Thermal Resistance of Power Semiconductor Devices Koji Nishi Power Electronics, Semiconductor, DPAK Package, Thermal Resistance, Thermal Management VIEW
Mechanical Cycling Reliability Testing of Thermal Interface Materials for Semiconductor Test David L. Saums Tim Jensen, Carol Gowans, Ron Hunadi, Mohamad Abo Ras Thermal resistance, thermal interface, semiconductor test, durability, cycling, device under test VIEW
Development of a 3D Printed Loop Heat Pipe Bradley Richard William G. Anderson, Joel Crawmer Loop Heat Pipe, Additive Manufacturing, Wick, CubeSats, Thermal Management VIEW
Accurate Thermal Transient Measurements Interpretation of Monochromatic LEDs Alexeev Antonn Genevieve Martin, Grigory Onushkin, Jean-Paul Linnartz LED, Secondary Heat Path, Dynamic Thermal Compact Model, Reliability, Thermal Transient Testing, Finite Element Analysis VIEW
Assessment of Critical Heat Flux on Finite Size Surfaces Under Pool Boiling Julia Reed Vijay K. Dhir Maximum heat flux, pool boiling, finite surface, microstructure VIEW
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