Paper Info

Title
Use of High Conductivity Spreaders on the Back of Single-Sided PCB to Enhance Heat Transfer and Thermal Capacitance in Electronics Systemsnn
Abstract
It is challenging to cool electronics packages in handheld fanless devices. The cooling problem increases when the memory package is stacked on top of the System on Chip (SOC) package, as the memory package increases the thermal resistance from the top of the SOC to the thermal spreader over the SOC. This paper explores the use of high conductivity heat spreaders below a single-sided PCB to enhance heat transfer, thereby improving the transient thermal response and steady state T_J and sustained power of electronics packages in devices.
Source
SEMI-THERM 34
Class
Heat Spreader
Author
Joshua Een
Other Author
Joshua Een
Upload
s04p1-008.pdf

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