Paper Info

Molecular Dynamic Simulation of Evaporative Heat Transfer on Graphene Coated Silicon Substrate for Electronics Cooling
Two-phase cooling such as thin film evaporation is becoming increasingly popular for thermal management of high powered electronics due to the high latent heat associated with the phase change process. Nanoengineered surfaces have been shown to improve two-phase heat transfer performance through enhanced wettability and reduced interfacial thermal resistance. However, how interfacial resistance varies with surface wettability and how such resistance can affect thin-film evaporative transport is still not well understood. In this study, we investigate the evaporative transport characteristics and wetting state of an evaporating thin liquid film on both smooth and nanocoated surfaces using Molecular Dynamics (MD) simulations. The surface wettability between liquid argon and silicon (100) surface coated with 0, 1, and 3 layers of graphene is characterized using equilibrium molecular dynamics methods. The associated interfacial thermal resistances and the evaporation rates are explored using non-equilibrium molecular dynamics methods, in which a hot and cold solid substrate are implemented to facilitate the evaporation and condensation of liquid argon molecules. Contributions provided by this paper:n1) Applying one or three layers of graphene coatings on a silicon substrate yields 80.7% and 237% higherninterfacial thermal resistance between the solid substrate and liquid argon.n2) Addition of one and three layers of graphene reduces the evaporation rate by 38% and 62% times with thensame temperature gradient between hot and cold source compared to evaporation form bare silicon surface.n3) Addition of one and three layers of graphene results in an increase in the apparent contact angle from 7° ton13° and 17°, respectivelyn4) There exists a strong dependence of evaporative mass transport rate on the thermal resistance across the solid-nliquid interface and the surface wettability. An increasing level of non-wetting lead to increased interfacial thermal resistance and therefore a lower evaporation rate.
Binjian Ma
Other Author
Shan Li, Damena Agonafer, Baris Dogruoz

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