Paper Info

A Methodology to Determine the Sites of Variability in an LED Assembly
Variations in the manufacturing assembly process together with any changes in materials sourcing can give rise to variation in the functional performance of an LED. These variations can lead to differences in thermal characteristics such as Zth (transient thermal impedance) and RthJC (thermal resistance between chip junction and case. This study aims to analyze the measured variations of a number of LED samples and explore a methodology that will provide insights into the root cause of those variations, In addition the statistical properties of the variations are applied in a Monte Carlo thermal modelling context. Such insights and modelling methods would be employed by a lighting engineer when selecting LEDs and when simulating their thermal dependent optical behavior.
Robin Bornoff
Other Author
Thomas Mérelle, Josephine Sari, Alessandro Di Bucchianico, Gabor Farkas

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