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AI Technology

AI Technology, Inc. has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. has been one of the leading forces in development of patented applications of advanced material and adhesive solutions for electronic interconnection and packaging. The company continues to provide adhesive solutions for component and substrate bonding for both military and commercial applications. It’s thermal interface material solutions of patented phase-change thermal pads, thermal grease and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductor and modules, computer and communication electronics.

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Alpha Novatech

Alpha Novatech, Inc. is your partner for Thermal Solutions.

We offer a wide variety of standard heat sinks and accessories. Our product line includes natural convection, forced convection, and active heat sinks. We also offer various attachment methods and hardware for almost any application. In addition, we can offer free heat sink thermal simulations. Standard or custom heat sinks in prototype to production quantities Quick and easy customization without NRE fees, while featuring short lead times Standard parts are carried in stock Lead time for custom parts of 1-2 weeks is possible for initial quantities.

Analysis Tech

www.analysistech.com

Semiconductor Thermal Testers: Complete measurement systems for device thermal resistance, impedance, & die-attach quality using transient & steady state electrical-junction temperature-measurement.   Transient structure function analysis is used to delineate internal-package resistances & measure Rjc via JEDEC 51-14.   Power Cycling systems for device life-testing with automatic monitoring of thermal deterioration with age.  Test services offered.

Thermal Interface Material Testers: ASTM D5470 based testers offering fast & accurate measurement of thermal conductivity & contact resistance of electronic-packaging materials over a wide range of thickness, pressure, & temperature.  Test services offered.

Event Detectors: Electrical reliability-testers for passive interconnects including solder joints & connectors, with easy integration to thermal-cycle, drop-test, shock, and vibration gear; based on JEDEC and IPC standards for interconnect reliability testing

ANSYS

ANSYS is the leading provider of electronic cooling, electromagnetic field, circuit and system simulation software for the design of high-performance electronic equipment. Companies throughout the world rely on ANSYS software to solve thermal integrity, mechanical reliability, signal integrity, power integrity and EMI challenges in IC, package and PCB and perform power optimization in custom IC’s. Ansys develops open and flexible simulation solutions that enable users to simulate design performance directly on the desktop, providing a common platform for fast, efficient and cost-effective product development, from design concept to final-stage testing and performance validation. Engineers rely on ANSYS to achieve first-pass system success when designing mobile communication devices, broadband networking components and systems, integrated circuits (ICs), printed circuit boards (PCBs) and electromechanical systems. ANSYS’ unique multiphysics platform provides a highly-accurate design flow for fast, efficient and simulation driven product development.

AOS Thermal Compounds

AOS Thermal Compounds developed the first non-silicone thermal interface materials for AT&T in the 1960’s. Today we manufacture the lowest thermal resistance and pump-out resistant thermal greases, unique Micro-Faze thermal pads, and a high performance and economical line of Sure-Form gap fillers

Binghamton University

S3IP brings together teams of experts from industry and academia to address pressing real-world problems in the systems integration and manufacturing of electronics. Our research centers focus on topics related to electronics packaging, flexible electronics, energy-efficient data centers and energy harvesting and storage. Binghamton University, the premier public university in the Northeast, is home to S3IP. Our PhD-level staff members and affiliated faculty are ready to assist companies in New York State and beyond with collaborative problem solving. S3IP, which recently celebrated its 10th year as a New York State Center of Excellence, and its constituent research centers have contributed more than $1 billion in economic impact to New York State since 1996.

Cadence Design Systems, Inc.

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. Learn more at cadence.com.

CEJN North America

CEJN North America, the Quick Connect Solution Provider, delivers couplings and solutions for your liquid cooling needs. Our Leak-Free, Non-Drip coupling series offers high flow and minimal pressure drop; and Blind Mating options range from DN 3 to DN 19. CEJN’s new UltraFlow Series features an extremely high flow combined with an unequalled low pressure drop. Customized solutions are also available. At CEJN, we develop our products for a future in liquid cooled data centers. Contact us: PHONE: 847-263-7200, by email: customer.service.usa@cejn.com, or via www.cejn.us.

Celsia Inc.

Celsia specializes in custom heat sink design and manufacturing using liquid two-phase devices: heat pipes and vapor chambers. Through its US headquarters and Taiwan design & production facility, the company’s goal is to deliver fast, affordable, and reliable thermal solutions for the most demanding applications including high density electronics, performance CPU / GPU, amplifiers, HBLEDs, ASICS, and rugged systems.  In recent years, Celsia has shipped over 2.5 million thermal assemblies to a global custom base in the telecommunications, computer, test equipment, defense, laser, and medical markets.

Chilldyne

Chilldyne sells liquid cooling systems optimized for data centers. Our direct-to-chip liquid cooling Cool-Flo® system offers all the benefits of liquid cooling without reducing uptime and with no worries about leaks. The system utilizes hybrid air-and-liquid-cooled heat sinks and negative pressure to deliver a zero-downtime, leak-proof, low-cost solution. Our system is optimized for ease of installation and operation so that all the rack and server level connections do not require a plumber. The system installs into most servers and racks with no modifications making the switch to modern liquid cooling an easy decision.

COFAN USA

At COFAN USA, we keep your hot technology cool. COFAN USA is an industry leading manufacturer in thermal management solutions with inhouse thermal engineering team providing thermal simulation service and consultation to our customers. With more than 20 years of expertise, we’ve had the pleasure of serving a diverse customer base in many industries. We offer quick turnaround product inquiries and prototyping services. We pride ourselves in giving the best possible customer service, the highest quality products with the shortest lead time, and competitive pricing in the industry. To learn more about us, please visit www.cofan-usa.com

CPC

CPC thinks beyond the point of connection to help protect valuable electronics. Designed specifically for liquid cooling applications, rugged couplings withstand long periods of connection yet disconnect reliably without drips.

CoolIT Systems

CoolIT Systems specializes in scalable liquid cooling solutions for individual servers through to the world’s largest data centers. Through its modular, rack-based Direct Contact Liquid Cooling technology, Rack DCLC™, CoolIT enables dramatic increases in rack densities, component performance and power efficiencies. From cold plates specifically designed for the latest high TDP processors from Intel, NVIDIA and AMD, through to manifolds and heat exchangers, CoolIT’s reliable technology installs into any server or rack, ensuring ease of adoption and maintenance.

Delta Electronics (Americas) Ltd.

The Delta Fan and Thermal Products Group designs and builds innovative cooling systems that perform to the highest standards – even in harsh environments.

The Delta Fan and Thermal product line includes a full range of axial fans, blowers, heat pipes, vapor chambers and liquid cooler products.

Our Delta-exclusive patented design and innovative structure boosts cooling performance and reduces system noise. Delta fans and thermal products are sold globally, serving an array of industries and organizations. Highly efficient cooling solutions can be customized to suit the needs of virtually any business.

Dynathron

DYNATRON CORPORATION

Dynatron Corporation, an industry leader in thermal solutions spanning a wide spectrum of consumer to enterprise products. With missions of CPU coolers sold worldwide since 1995. Dynatron has established its reputation over the years and continues to reinforce it with world class support and inventive ways to keep critical systems operating.
It is also the first company to invent a uniquely designed radiator equipped with a built-in pump into the liquid cooler. Coupled with an integrated Skived fin and its proprietary Vapor Chamber technology into a heatsink, has raised the standard in liquid cooling

Electronics Cooling

Electronics Cooling®

Electronics Cooling® magazine has been providing practical education in the field of thermal management of electronics since 1997. We cover the most common thermal management solutions including materials, techniques, components and devices, and their associated thermal properties used in electronics packaging. Electronics Cooling® is published by ITEM Media.

Element Six Technologies

Element Six, a De Beers Company, designs, develops and produce diamond supermaterials. Poly- and single crystal diamond products and composites are used in fine machining and polishing applications. New technologies using CVD diamond include thermal management for laser diodes, power devices, RF amplifiers and resistors. Element Six also manufactures high power laser optics, beam splitters, IR spectroscopy accessories and high energy radiation sensors.

Fujikura Kasei

Fujikura Kasei Co. Ltd. is the global supplier of coatings for automotive and electronic parts with its history reaching 80th anniversary this year.

We have developed thermal radiation clear-coating which can easily increase the emissivity of substrates by applying the coating.

Since its paint film has higher emissivity than anodized aluminum, our coating can offer strong support for advancement in performance of heat emitting materials.

With its advantage being in a form of coating, we can also offer flexible solution for various shape and substrates as well as physical property needs.

For anyone who is looking for some countermeasure for thermal issues, please visit our booth as we can propose optimal coating choices.

Fujipoly America

Fujipoly is a world leader in the manufacture of Sarcon® Thermal Interface Materials, which are used to help keep sensitive electronic components cool by eliminating the air gap between the component and heat sink. Our products range in thermal conductivity from 1.0m watt/m-K to 17 watt/m-K, offering some of the lowest thermal resistance in the industry. Our product line-up consists of soft Gap Filler Pads, Conformable Putties, Form-In-Place Gap Fill Materials, as well as custom and standard die-cut thin film materials. Our wide range of material types, coupled with the widest range of thermal conductivity, allows us to meet most design criteria. Fujipoly has nine locations in North America, Europe, and Asia making it easy for us to assist our customers at the local level.

Future Facilities Inc.

We set Future Facilities up to deliver the power of engineering simulation into the hands of an emerging data center industry. We created a tool optimized for data centers, designed to be used by the DC professional, and made it powerful, intelligent, automated and connected. Five years later, we tuned our technology to deliver the same benefits to the thermal management of electronics and provide an integrated toolset for these two converging industries.

We develop engineering simulation software that allows our customers to quantify and qualify business decisions balancing risk against cost. Our offering covers the full spectrum starting from electronics design to data center design and operations. Our software provides a safe, offline environment in which to create virtual prototypes, troubleshoot existing designs and run what-if scenarios for future configurations.

Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

 

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

KULR

KULR’s proprietary carbon fiber-based architecture replaces less efficient aluminum and copper based heat spreaders and exchangers, which are energy intensive and less environmentally friendly to produce. Carbon fiber thermal interface materials are superior alternatives to particle based thermal interface materials for higher performance, lower contact pressure, higher compliance, and longer reliability.

Jones Tech

Jones Tech provides creative thermal and EMI solutions to improve the reliability of electronic equipment. Established in 1997, with its rich R&D resources and manufacturing experience, Jones Tech has been serving consumer electronics, telecommunications, IT, medical, and renewable energy customers. We are a long-term supplier to 4 of the top 5 Silicon Valley companies. Our thermal interface material (TIM) includes thermal pads, gel, grease, thermal phase change materials (PCM), and graphite TIM. For heat spreaders, we are a leading supplier of synthetic and natural graphite. We have in-house rotary and flatbed die-cutting capabilities. For heat storage materials, we offer PCM pads, gel and potting material. We can help with manual or robotic dispensing. Additionally, we help solve problems with EMI and RF related components.

LiSAT

LISAT, manufacturer of Thermal Interface Material & EMI products. HQ in U.S., LISAT have operations in Asia. In U.S., we provide Thermal Management Solution to customers & work with R&D Engineers at Design Centres. We provide technical support & samples to our customers to test our materials. Our Asia operations provide manufacturing, converting, technical & sales to customers’ worldwide. Our products : TIM Pad, Insulator, Silicon Free TIM, Gel, Grease, Mylar, Graphite, Conductive Plastic, Conductive Elastomer, Fabric-Over-Foam, Microwave Absorbing Material, Metal Finger Stock, EMI Shielding Solution, Switching Power Supply, Desktop & Wall Mount Adaptor, Metal Core PCB, Ceramic PCB. Email: alan@lisat.net

Long Win

Long Win specializes in research, design, manufacture and service of scientific instruments for thermal managing, material & fluid mechanic and educational fields. Long Win holds a leading position on research, measurement and inspection apparatus for the electronic cooling market. Some of their product lines include thermal-related measurement apparatus for fan performance, TIMs, cooler modules, heat pipes, vapor chambers, IC packages, LEDs, liquid cooling, thermal and flow test for servers, racks and data center, and natural-convection simulation. They have more than 100 types of apparatus in their 18,000 sq. ft. lab which is located in Taiwan and a lab based in Livermore, California.

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MAN ZAI

As a leader in electronic liquid cooling system, Man Zai offers a wide range of thermal modules for CPU, VGA, LED, Bio-Chemical and automotive electronic device. The thermal team is equipped with state of the art hardware and software, which includes wind tunnel testing, hydraulic test equipment, simulation software, helium & air leakage test equipment and ultra-high-speed pre-filling technology. We are able to establish long-term relationships with several world-wide famous brand names. The quality system and sophisticated R&D capability in Man Zai will provide our customers the best thermal solution.

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Mentor Graphics Corporation – Mechanical Analysis

The Simcenter™ portfolio is a range of simulation software and test solutions that support development of a product digital twin to aid improved design from early stages, through to manufacture and lifecycle management.

In electronics and semiconductor sector, Simcenter portfolio includes accurate electronics cooling, CFD and multi-physics simulation software products to meet different application thermal modeling requirements and to suit the wide demographic of engineering software user skill level, experience and discipline. These proven solutions provide workflow advantages to enable faster, confident development of reliable products. 3D Simulation software incl.: Simcenter Flotherm, Simcenter Flotherm XT, Simcenter STAR-CCM+ Simcenter FLOEFD, and Simcenter 3D …

Accurate, repeatable thermal characterization testing is achievable using Simcenter T3STER thermal transient test technology. Test applications include packaged ICs, LEDs, TIM materials, and for power semiconductor thermal reliability assessment (Simcenter POWERTESTER). A unique test and simulation capability is in automatic package thermal model calibration for highest accuracy simulation.

https://www.mentor.com/mechanical .
https://www.siemens.com/simcenter

MSC Software

Software Cradle is a leading provider of Computational Fluid Dynamics (CFD) software including SC/Tetra (general purpose unstructured mesh), scSTREAM (general purpose Cartesian mesh), and HeatDesigner (Cartesian mesh for electronics). Since inception in 1984, Cradle has established itself as a major innovator that is advancing the role of simulation in engineering design. Our software products are well known for ease of use, exceptionally fast and powerful meshing, efficient solvers, sophisticated physical models, and professional post processing. In 2016, Software Cradle has joined MSC Software Corporation, the worldwide leader in the field of multidiscipline simulation.

NeoGraf Solutions

NeoGraf Solutions, LLC is a company with a rich history that stretches back over 135 years. With a strong culture of innovation and development, NeoGraf offers the largest portfolio of flexible graphite thermal management solutions. NeoGraf offers solutions for a variety of markets ranging from Thermal Interface materials for Computing and Power Electronics to heat spreaders for the most demanding of smartphones.

6 R&D 100 awards over the past 15 years, including eGRAF® HITHERM™ Thermal Interface Material, eGRAF® SPREADERSHIELD™ heat spreaders, both Natural and Synthetic Graphite, and the 1st compressible graphite TIM, is a testimony to the long

Netzsch Instruments

https://www.netzsch.com/us/

Package Science Services

We are IC packaging experts. Decades of experience support development of standard and custom high performance IC packages that precisely match the performance of your chip or device on time and within your budget. Our engineering teams provide package selection, design, layout, prototype, and production solutions. Design, modeling and simulation tools are used for signal and power integrity, thermal/mechanical, and manufacturing process simulation and analysis. To close the loop, thermal and electrical test labs provide in-house validation and testing services. Located in Santa Clara, CA. Contact us and come by for a tour of our labs and discuss how we can help you solve your IC packaging challenges.

QuantaCool Corporation

Highly efficient, environmentally friendly, reliable passive two-phase cooling systems for data centers and high-performance computers. QuantaCool Corporation has developed and patented two-phase cooling systems that use highly efficient proprietary cold plates to remove heat without pumps or water. Waste heat to be moved to remote locations with greater reliability. QCC’s technology improves heat management and enables energy recovery possibilities. QuantaCool has introduced both PolarRak™ and PolarBox™ systems to serve the Data Center and High Performance computing segments.

The QCC PolarRack™ System, requires less initial capital, increases data center capacity, and reduces total energy costs by up to 80%. QCC’s PolarBox™ is intended for use by gamers and bit coin miners who require intensive computing power.

Shin-Etsu MicroSi

Shin-Etsu MicroSi is the leader in Thermal Interface Material, we have also developed an extensive line of Molding Compounds, Encapsulants, Silicon and Epoxy coatings along with die Attachment Materials. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications. Some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads. Shin-Etsu products are delivered globally to many major and minor companies involved in the fabrication process of electronics and microelectronics.

Solid State

Solid State Technology

Solid State Technology is part of the Semiconductor Manufacturing and Design Network which includes the SemiMD portal, www.semiMD.com. Solid State Technology reaches the largest, most qualified community of decision makers for semiconductor and electronics manufacturing through the magazine, email newsletters, website, webcasts and The ConFab Conference & Networking event which will be held at The Hotel del Coronado in San Diego May 14th – 17th, 2017. Topics covered include Advanced Packaging, MEMS, LEDs, Displays, and Materials as well as current trends in the industry. Visit us here www.solid-state.com.

Staubli

Stäubli is an innovative mechatronics solutions provider with three dedicated activities: Connectors, Robotics and Textile. With a workforce of over 4500, Stäubli has a presence in 25 countries and agents in 50 countries around the world. As one of the leading manufacturers of quick connector systems, Stäubli covers connection needs for all types of fluids, gases and electrical power.  These standard or specific products – including single and multiple connectors, tool changers and quick mold change systems – combine  performance, quality, safety, dependability and durability.

TCPoly, Inc.

TCPoly has developed high thermal conductivity plastics for use on low cost 3D printers. The 3D printing materials have thermal conductivity up to 50X higher than traditional plastics (10 W/m-K) and when combined with the design freedom of 3D printing, can be used to make high performance heat transfer products including plastic heat exchangers, heat sinks, coldplates, and heat conductive cases and enclosures.

t-Global Technology Limited

T-Global Technology is dedicated to the development, manufacture and research of total thermal solution and materials including heat sink, heat pipes, vapor chamber, thermoelectric cooling chip, fan, TIMs and thermal simulation service.

We provide our customers with rapid sampling, customized manufacturing and professional technical support. With rich experience in research and development, T-Global is already become the designated and direct supplier of over 2,500 enterprises worldwide.

Over 15 years, T-Global keeps on providing customers with high quality products by using own innovation which is already become a total thermal solution expert now.

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Thermal Engineering Associates

TEA is a company founded by Bernie Siegal, a 35+-year veteran and recognized technical leader in the semiconductor thermal field. The company’s mission is to provide a central source for the products and services necessary for proper semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related measurement, modeling and/or management requirements.

ThermAvant Technologies

ThermAvant Technologies, LLC designs, develops and delivers custom thermal solutions to improve size, weight, performance and/or costs of advanced energy and technology platforms. The leading provider of Oscillating Heat Pipe products, ThermAvant also offers custom Cold Plates, Ejector Refrigerators, and Design & Engineering services.

Wacker Chemical Corp.

WACKER is a global silicone leader with a broad portfolio of ‎products designed for the needs of the electronics industry. Our SEMICOSIL®, SilGel®, and ELASTOSIL® brands are globally recognized in the industry. Please stop by our booth and learn how our potting gels, adhesives, and newest thermal interface materials can help you meet your design challenges.

W. L. Gore & Associates

W. L. Gore & Associates is a global materials science company dedicated to transforming industries and improving lives. Founded in 1958, Gore has built a reputation for solving complex technical challenges in the most demanding environments.