Organizing Committee

Herman Chu, Director – Design Engineering, Celestica Inc.
Vadim Gektin, Principal Engineer, QualcommTechnologies, Inc.
Kathryn Kirsch, Senior Research Engineer, Raytheon Technologies, Inc.
Bill Maltz, President, Electronic Cooling Solutions, Inc.
Nader Nikfar, Principal Thermal Engineer, Qualcomm Technologies, Inc.
Devan Pellicone, Lead Engineer – Product Development, Advanced Cooling Technologies, Inc.
Adriana Rangel, Mechanical Engineer, Cisco Systems Inc.
Dave Saums, Principal, DS&A LLC
Tejas Shah, Senior Thermal Engineer, nVidia Corporation
Guy Wagner, Director, Electronic Cooling Solutions, Inc.
Ross Wilcoxon, Associate Director, Mechanical Engineering, Mission Systems, Collins Aerospace Inc.

Any questions may be addressed to:
Dave Saums, DS&A LLC, General Chair  •  Email: dsaums@dsa-thermal.com
Vadim Gektin, Qualcomm Technologies, Program Chair  •  Email: atwprogramchair@gmail.com