Our research centers focus on topics related to electronics packaging, flexible electronics, energy-efficient data centers and energy harvesting and storage:

The Center for Advanced Microelectronics Manufacturing (CAMM) - As part of America's first Innovation Institute for Flexible Hybrid Electronics Manufacturing, CAMM demonstrates the feasibility of roll-to-roll flexible electronics manufacturing.

The Center for Autonomous Solar Power (CASP) - conducts research related to thin-film solar cells, supercapacitors, thermoelectric cells and reliability studies with an emphasis on Earth-abundant, low-toxicity materials.

The Center for Heterogeneous Integration Research in Packaging (CHIRP) address basic and applied research in global interconnects, efficient power delivery, system design, thermal management, novel materials, reliability and other topics.

The Center for Energy-Smart Electronic Systems (ES2) – research focused on energy efficiency of electronic systems, including data centers by holistically managing workloads and controlling cooling resources for optimal energy consumption.

The Integrated Electronics Engineering Center (IEEC) – research in electronics packaging with capabilities including capabilities include reliability analysis; mechanical/thermal analysis and testing; solder mechanics; failure mechanism determination; and micromechanical analysis and testing.

The NorthEast Center for Chemical Energy Storage (NECCES) - supports basic research in the design of the next generation of lithium-ion batteries. The center focuses on the development of new chemistries and improving our fundamental understanding of the physical and chemical processes that occur in these complex systems.