Semiconductor Thermal Testers

Complete measurement systems for device thermal resistance, impedance, & die-attach quality using transient & steady state electrical-junction temperature-measurement. Transient structure function analysis is used to delineate internal-package resistances & measure Rjc via JEDEC 51-14. Test services offered.

Thermal Interface Material Testers

ASTM D5470 based testers offering fast & accurate measurement of thermal conductivity & contact resistance of electronic-packaging materials over a wide range of thickness, pressure, & temperature. Test services offered.

Event Detectors

Electrical reliability-testers for passive interconnects including solder joints & connectors, with easy integration to thermal-cycle, drop-test, shock, and vibration gear; based on JEDEC and IPC standards for interconnect reliability testing.