Aavid Thermacore
Aavid Thermacore, Inc. specializes in the custom design, development, and manufacturing of highly engineered thermal management systems and components for a variety of OEM applications across a diversified set of global markets that include military/aerospace, computer, telecommunications, energy conversion, medical and test equipment.
AI Technology
AI Technology, Inc. has more than 25 years of experience and successes in helping military, aerospace, computer, and super-computer manufacturers with thermal compound and thermal interface materials for building some of the most reliable electronic devices and computers. Since pioneering the use of flexible epoxy technology for microelectronic packaging in 1985, AI Technology, Inc. has been one of the leading forces in development of patented applications of advanced material and adhesive solutions for electronic interconnection and packaging. The company continues to provide adhesive solutions for component and substrate bonding for both military and commercial applications. It’s thermal interface material solutions of patented phase-change thermal pads, thermal grease and gels and thermal adhesives set many bench marks of performance and reliability for power semiconductor and modules, computer and communication electronics.
Alpha Novatech
Alpha Novatech, Inc. is your partner for Thermal Solutions. We offer a wide variety of standard heat sinks and accessories. Our product line includes natural convection, forced convection, and active heat sinks. We also offer various attachment methods and hardware for almost any application. In addition, we can offer free heat sink thermal simulations. Standard or custom heat sinks in prototype to production quantities Quick and easy customization without NRE fees, while featuring short lead times Standard parts are carried in stock Lead time for custom parts of 1-2 weeks is possible for initial quantities
Analysis Tech
Semiconductor Thermal Testers Complete measurement systems for device thermal resistance, impedance, & die-attach quality using transient & steady state electrical-junction temperature-measurement. Transient structure function analysis is used to delineate internal-package resistances & measure Rjc via JEDEC 51-14. Power Cycling systems for device life-testing with automatic monitoring of thermal deterioration with age. Test services offered. Thermal Interface Material Testers ASTM D5470 based testers offering fast & accurate measurement of thermal conductivity & contact resistance of electronic-packaging materials over a wide range of thickness, pressure, & temperature. Test services offered. Event Detectors Electrical reliability-testers for passive interconnects including solder joints & connectors, with easy integration to thermal-cycle, drop-test, shock, and vibration gear; based on JEDEC and IPC standards for interconnect reliability testing. www.analysistech.com
ANSYS
If you’ve ever seen a rocket launch, flown on an airplane, driven a car, used a computer, touched a mobile device, crossed a bridge, or put on wearable technology, chances are you’ve used a product where ANSYS software played a critical role in its creation. ANSYS is the global leader in engineering simulation. We help the world’s most innovative companies deliver radically better products to their customers. By offering the best and broadest portfolio of engineering simulation software, we help them solve the most complex design challenges and engineer products limited only by imagination.
AOS Thermal Compounds
AOS Thermal Compounds manufactures the most durable non-silicone thermal interface materials including thermal greases, Sure-Form gap fillers and unique Micro-Faze thermal pads (not phase change material).
Calyos
Calyos is a cooling solution provider specializing in the Loop Heat Pipe (LHP) technology. Thanks to its know-how and protected IP, Calyos positions itself as the world leader in LHP manufacturing. Delivering high performing products, Calyos succeeded to address several industries with 2 product lines adapted to different ranges of power. For low power (10W-1000W), the company supplies cooling products for Data Center, Workstation/Desktop and LEDs. For high power (1000W-40KW), Calyos mainly addresses power converter manufacturers (Transports, Wind Turbines, Industrial Processes…).
CEJN
Fluid products must be leak free, able to quickly connect and disconnect, able to withstand the transferred media and to endure the operating conditions to which they are subjected. CEJN’s Fluid products encompass all of these necessities. Our fluid couplers and nipples are available in valved and valveless designs for low- and medium- pressure applications. Presented here are fluid couplings and nipples, hoses and hose kits for fluid applications. www.cejn.us.
Celsia Inc.
Celsia specializes in custom heat sink design and manufacturing using liquid two-phase devices: heat pipes and vapor chambers. Through its US headquarters and Taiwan design & production facility, the company’s goal is to deliver fast, affordable, and reliable thermal solutions for the most demanding applications including high density electronics, performance CPU / GPU, amplifiers, HBLEDs, ASICS, and rugged systems. In recent years, Celsia has shipped over 2.5 million thermal assemblies to a global custom base in the telecommunications, computer, test equipment, defense, laser, and medical markets.
Center for Energy Smart Electronic Systems
The NSF Industry/University Cooperative Research Center for Energy-Smart Electronic Systems (ES2 is a collaboration among government, academia and industry to discover and provide industry-driven solutions and technologies to make data centers energy-efficient. ES2’s grand vision is to enable cognitive approaches for realizing self-aware and self-managing electronic systems that optimize energy consumption at any specified performance, availability and reliability level. Our mission is to develop the foundations and multidisciplinary solutions to accomplish that vision. ES2 comprises four domestic university sites, one international site and over 20 industry members working on 15 unique research projects.
Chilldyne
Chilldyne sells liquid cooling systems optimized for data centers. Our direct-to-chip liquid cooling Cool-Flo® system offers all the benefits of liquid cooling without reducing uptime and with no worries about leaks. The system utilizes hybrid air-and-liquid-cooled heat sinks and negative pressure to deliver a zero-downtime, leak-proof, low-cost solution. Our system is optimized for ease of installation and operation so that all the rack and server level connections do not require a plumber. The system installs into most servers and racks with no modifications making the switch to modern liquid cooling an easy decision.
Cofan
Cofan, 22 years in computer hardware manufacturing industry, can be your one stop supplier of components, mechanical parts or complete assemblies. Cofan owns factories in China and Taiwan to offer you best pricing, fast turnaround, and good quality. We are a high mix low volume manufacturer. We supply to telecommunications, electronic manufacturing services (EMS), data center (server) and computer hardware companies.
Cofan offers: AC & DC Fans, Heat Sinks, Heatpipes, Metal parts (machined, extruded, forged, stamped, die-cast), Plastics parts (machined, injection molded, pressure molded), Hardware (screws, PEMs, springs) and PCBs and MCPCBs.
Cooling Source
Cooling Source, Inc. is a heatsink manufacturer offering the most comprehensive value-added standardized or custom heatsink solutions for today’s global market. Using the very latest technology available to heatsink manufacturers, we offer a wide range of products for our global market clients. Our company goal is simple: to deliver the highest value to our customers as the premier heatsink manufacturer, offering standard or custom designed products, and services above and beyond what our customers expect. If you are unsure whether to use a standard or custom heat sink, allow our experts to help you make the right decision for both your overall cost, tooling time, and delivery time.
CPC
CPC thinks beyond the point of connection to help protect valuable electronics. Designed specifically for liquid cooling applications, rugged couplings withstand long periods of connection yet disconnect reliably without drips.
Cradle North America
Software Cradle is a leading provider of Computational Fluid Dynamics (CFD) software including SC/Tetra (general purpose unstructured mesh), scSTREAM (general purpose Cartesian mesh), and HeatDesigner (Cartesian mesh for electronics). Since inception in 1984, Cradle has established itself as a major innovator that is advancing the role of simulation in engineering design. Our software products are well known for ease of use, exceptionally fast and powerful meshing, efficient solvers, sophisticated physical models, and professional post processing. Cradle’s worldwide presence consists of offices in Japan, North America, France, and a network of distributors servicing and supporting all parts of the globe.
Degree Controls Inc.
DegreeC engineers airflow and delivers innovative solutions to thermal issues in a variety of mission-critical applications. We make environmental sensors, instruments for system performance testing, and control solutions that deliver precise air flow where and when it is needed most. We do this at all scales of system infrastructure from miniature sensors for process controls in circuit board environments to comprehensive ventilation and cooling system controls for critical facilities.
Dupont
DuPont™ Temprion™ thermal management materials from DuPont Electronic Materials offer a high-quality, reliable choice for managing heat and reducing thermal resistance in a wide variety of electronic assemblies. This means enhanced performance and an extended lifetime for today’s technologically advanced electronic devices and products. Temprion™ electrically insulating films, adhesive thermal tapes, non-silicone greases and dispensable gap fillers offer excellent thermal conductivity, lower thermal resistance, higher heat dissipation and improved thermal stability during continuous operation. Better yet, they’re from DuPont—a name you know and trust—and are backed by the most reliable test data in the industry. So when it comes to managing heat, turn to DuPont™ Temprion™ for performance you can count on.
Electronics Cooling®
Electronics Cooling® magazine has been providing practical education in the field of thermal management of electronics since 1997. We cover the most common thermal management solutions including materials, techniques, components and devices, and their associated thermal properties used in electronics packaging. Electronics Cooling® is published by ITEM Media.
Element Six Technologies
Element Six fabricates and sells engineered synthetic poly- and single crystal diamond products and diamond composites. Technologies using CVD Diamond material include thermal management for component such as laser diodes, laser diode arrays, power devices, RF amplifiers, RF resistors, LED’s and others. We also manufacture high power laser optics, beam splitters, IR spectroscopy, high energy particle detectors as well as electrochemistry and products for scientific applications. In order to address the ever increasing requirements in the semiconductor industry, an extreme material like diamond makes its way into applications where it was not considered previously. Through its high thermal conductivity, extreme stiffness, low density and abrasion resistance it is becoming the material of choice for demanding applications such as wafer carriers, heating components, scanner mirrors and laser shutters.
Fujipoly America
Fujipoly is a world leader in the manufacture of Sarcon® Thermal Interface Materials, which are used to help keep sensitive electronic components cool by eliminating the air gap between the component and heat sink. Our products range in thermal conductivity from 1.0m watt/m-K to 17 watt/m-K, offering some of the lowest thermal resistance in the industry. Our product line-up consists of soft Gap Filler Pads, Conformable Putties, Form-In-Place Gap Fill Materials, as well as custom and standard die-cut thin film materials. Our wide range of material types, coupled with the widest range of thermal conductivity, allows us to meet most design criteria. Fujipoly has nine locations in North America, Europe, and Asia making it easy for us to assist our customers at the local level.
Future Faciltities
We set Future Facilities up to deliver the power of engineering simulation into the hands of an emerging data center industry. We created a tool optimized for data centers, designed to be used by the DC professional, and made it powerful, intelligent, automated and connected. Five years later, we tuned our technology to deliver the same benefits to the thermal management of electronics and provide an integrated toolset for these two converging industries. We develop engineering simulation software that allows our customers to quantify and qualify business decisions balancing risk against cost. Our offering covers the full spectrum starting from electronics design to data center design and operations. Our software provides a safe, offline environment in which to create virtual prototypes, troubleshoot existing designs and run what-if scenarios for future configurations.
Jones Tech
Jones Tech PLC is engaged in providing creative solution to improve the reliability of electronics equipments. Established in year 1997, with its rich R&D resources and manufacturing experience, Jones Tech has been serving telecommunications, medical electronics, IT, industrial machinery manufacturing, rail transportation and renewable energy.
Kitagawa Industries
KITAGAWA INDUSTRIES America, Inc. is a global leading provider and manufacturer of EMI solution, thermal solution, and shock/vibration management products as well as plastic components. Our thermal solutions include Thermal Interface Materials (TIM) such as silicone and silicone-free pads, phase change gels, ultra-thin thermal films, and dual function materials. Our wide products varieties and custom-layered solutions can be engineered to meet very specific applications requirements. The newest items in our product line include our silicone-free, soft 5W/m*K (CPSH series) and our silicone-free, dual-function absorber and thermal pad (EMPV4 series).
KULR
KULR’s proprietary carbon fiber-based architecture replaces less efficient aluminum and copper based heat spreaders and exchangers, which are energy intensive and less environmentally friendly to produce. Carbon fiber thermal interface materials are superior alternatives to particle based thermal interface materials for higher performance, lower contact pressure, higher compliance, and longer reliability.
LISAT
LISAT, manufacturer of Thermal Interface Material & EMI products. HQ in U.S., LISAT have operations in Asia. In U.S., we provide Thermal Management Solution to customers & work with R&D Engineers at Design Centres. We provide technical support & samples to our customers to test our materials. Our Asia operations provide manufacturing, converting, technical & sales to customers’ worldwide. Our products : TIM Pad, Insulator, Silicon Free TIM, Gel, Grease, Mylar, Graphite, Conductive Plastic, Conductive Elastomer, Fabric-Over-Foam, Microwave Absorbing Material, Metal Finger Stock, EMI Shielding Solution, Switching Power Supply, Desktop & Wall Mount Adaptor, Metal Core PCB, Ceramic PCB. Email alan@lisat.net.
Long Win
Since 1985, Long Win specializes in research, design, manufacture and service of scientific instruments and apparatus for thermal management, material & fluid mechanics and educational fields. Long Win holds a leading position on research, measurement and inspection apparatus for the electronic cooling industry. Some of their product lines include thermal-related measurement apparatus for fan performance (automated airflow benches based on AMCA 210 standard), TIMs (Thermal resistance and conductivity measurement), cooler modules, heat pipes, vapor chambers, IC packages, LEDs, and natural-convection simulation. They have more than 100 types of apparatus in their 18,000 sq. ft. lab which is located in Taiwan. Long Win’s thermal is launched in Livermore California later in 2016. Website: www.longwin.com
MAN ZAI
As a leader in electronic liquid cooling system, Man Zai offers a wide range of thermal modules for CPU, VGA, LED, Bio-Chemical and automotive electronic device. The thermal team is equipped with state of the art hardware and software, which includes wind tunnel testing, hydraulic test equipment, simulation software, helium & air leakage test equipment and ultra-high-speed pre-filling technology. We are able to establish long-term relationships with several world-wide famous brand names. The quality system and sophisticated R&D capability in Man Zai will provide our customers the best thermal solution.
Materion
Materion Ceramics, Inc is a global leader in high performance engineered ceramics that enable customers to meet superior levels of product strength, reliability, miniaturization, weight savings, and thermal dissipation. . Our beryllium oxide (BeO) ceramics provide thermal conductivity second only to diamond, dissipating up to 325W/mK at room temperatures, ten times greater than Al2O3 and double AlN.
Mentor Graphics Corporation – Mechanical Analysis
Mentor Graphics – Mechanical Analysis provides leading electronics cooling software, FloTHERM® & FloTHERM® XT, and MicReD® thermal measurement test solutions to support faster development of reliable products.
Learn about compressing the thermal design process via seamless handling of complex CAD geometry and detailed PCB data allowing earlier, robust simulation. Hot topics include improved rotating geometry modeling (Fans), design of experiments, New SmartPart capabilities, automatic package model calibration, more …..
Semiconductor Thermal Characterization (incl. Rth ), Failure Diagnosis and Manufacturing Defect Identification – MicReD® T3STer® thermal transient test technology provides accurate, fast, repeatable measurement (JEDEC JESD51-14 compliant). Learn about using Structure Functions, Rth-Cth profiles of the heat flow path from junction to ambient, and automatic IC package model calibration using FloTHERM. Solutions include TeraLED® for LED lighting thermal/radiometric characterization, DynTIM™ for Thermal Interface Materials and the Power Tester™ range for power semiconductor reliability and lifetime prediction (e.g IGBTs), combining active power cycling and thermal degradation identification.
Netzsch
The Analyzing & Testing business unit of the NETZSCH Group develops and manufactures a complete high-precision instrument line for thermal analysis and thermophysical properties measurement, as well as offering world class commercial testing services in our laboratories. Our instrumentation is employed for research and quality control in the polymer sector, the chemical industry, the areas of inorganic and building materials, and environmental analysis. Instruments for controlling – such as for in-situ cure monitoring – complete our product line.
Package Science Services
We are IC packaging experts. Decades of experience support development of standard and custom high performance IC packages that precisely match the performance of your chip or device on time and within your budget. Our engineering teams provide package selection, design, layout, prototype, and production solutions. Design, modeling and simulation tools are used for signal and power integrity, thermal/mechanical, and manufacturing process simulation and analysis. To close the loop, thermal and electrical test labs provide in-house validation and testing services. Located in Santa Clara, CA. Contact us and come by for a tour of our labs and discuss how we can help you solve your IC packaging challenges.
Polymatech America
Polymatech Company is a global leader in electronic materials with state of the art material and process technology which are used in the electronic and automotive applications. The company is headquartered in Saitama, Japan and has a strong global presence in the Americas, Europe, and Asia. Polymatech has a very high standard in what they offer and it’s focused teams supplies solutions to it’s customers. The company believes strongly in innovation and meets and exceeds customer expectation. The current portfolio includes a vast range of products in consumer electronics, computer hardware, automotive, lighting, and telecom industries. Please contact: Ehsan Khan – (ehsan.khan@polymatech.com) or call 4156083354
QuantaCool
QuantaCool Corporation (QCC) has developed a patented two-phase passive cooling system that highly efficient proprietary cold plates to remove heat without pumps or water via a thermosyphon loop. This systems operate with out any pumps, and does not use water allowing us to safely and reliably to remove heat from any device.
Schunk Carbon Technology
Schunk Carbon Technology is a world leader in the development and production of carbon and graphite materials and components for the automotive and railway industries. Additionally, we provide two graphite-based solutions for the electronics cooling industry. The composite material, Aluminium Graphite (ALG), combines the low coefficient of thermal expansion and density of graphite with the excellent thermal properties of aluminium to create an ideal thermal management material for high-reliability applications. With its ready machinability, we can produce customized ALG parts in various quantities with a range of platings. We will premier our innovative phase change material (PCM) which is a novel approach to latent heat storage units. The nature of the PCM is such that it is self-encapsulating requiring no additional casing. Its expand-to-shape production process allows for custom designs at an attractive cost with optimal thermal properties.
Shin-Etsu MicroSi
Shin-Etsu MicroSi is the leader in Thermal Interface Material, we have also developed an extensive line of Molding Compounds, Encapsulants, Silicon and Epoxy coatings along with die Attachment Materials. The quality of our thermal interface material is among the most advanced in semiconductor manufacturing and has a wide range of use in thermal interface material applications. Some of which include thermal gels and grease, phase change materials, and high hardness silicone rubber pads.
Solid State Technology
Solid State Technology is part of the Semiconductor Manufacturing and Design Network which includes the SemiMD portal, www.semiMD.com. Solid State Technology reaches the largest, most qualified community of decision makers for semiconductor and electronics manufacturing through the magazine, email newsletters, website, webcasts and The ConFab Conference & Networking event which will be held at The Hotel del Coronado in San Diego May 14th – 17th, 2017. Topics covered include Advanced Packaging, MEMS, LEDs, Displays, and Materials as well as current trends in the industry. Visit us here www.solid-state.com.
Staubli Booth
Stäubli is an innovative mechatronics solutions provider with three dedicated divisions: Textile, Connectors and Robotics. With a workforce of over 4000, Stäubli has a presence in 25 countries and agents in 50 countries worldwide. As one of the leading manufacturers of quick connector systems, Stäubli covers connection needs for all types of fluids, gases and electrical power. These standard or specific products – including single and multiple connectors, tool changers and quick mold change systems – combine performance, quality, safety, dependability and durability.
Suzhou Tianmai Thermal Technology Co.,Ltd.
Suzhou Tianmai Technology is a high-tech enterprise committed itself to manufacture, sales andR&D. We have many products, such as, soft thermal conductive silicon pads,graphite etc. The company is a market-oriented enterprise insisting on taking customers as the center,and providing users with high-quality products,efficient and customization services. As we known,our company has a certain professional level and mature technology in thermal conductive and diffusion field.Meanwhile,it makes a good cooperation with some well known foreign and domestic colleges and manufactuers．Moreover,on the condition of urgent orders,our company can supply and offer special service for our clients. Contact: Vallen Luo -Sales Manager Cell: +86 137 5130 9475 Email: vallen_luo@sz-tianmai.com Web: www.sz-tianmai.com
Thermal Engineering Associates
TEA is a company founded by Bernie Siegal, a 35+-year veteran and recognized technical leader in the semiconductor thermal field. The company’s mission is to provide a central source for the products and services necessary for proper semiconductor thermal measurement and modeling and solutions to attendant thermal management problems. Through its own products and services, augmented by an extensive network of technical experts around the world, TEA can assist customers in finding solutions. The Tech Briefs and Hot Links pages provide useful information to those interested in semiconductor and electronics thermal issues. We welcome the opportunity to discuss your thermally-related measurement, modeling and/or management requirements.