We are proud to sponsor:
The SEMI-THERM Educational Foundation
Thermal Hall of Fame
Lifetime Achievement Award
The Thermal Hall of Fame’s Lifetime Achievement award recognizes persons in the electronics thermal management field who have made significant contributions to the development and commercialization of thermal management technologies during the course of their careers.
Hall of Fame members are entrepreneurial in their own right, pushing the boundaries to develop and commercialize technologies while mentoring those around them. They are respected in the field for sharing of their knowledge in a multitude of ways – technical papers and presentations, course teaching, lectures, participation in conferences and symposia.
Our 2017 winner of this annual award is Dr. Robert J. Moffat. Professor Robert J. Moffat received his Ph.D. at Stanford University and was a Professor of Mechanical Engineering at Stanford for 31 years.
Semi-Therm Hall of Fame Award
Dr. Robert Moffat
His research in the area of experimental heat transfer in turbulent boundary layers led to turbulence intensity based heat transfer correlations that are standard in the gas turbine industry. His work in convective cooling of electronic components in both forced and natural convection, in particular in developing the concept of the adiabatic heat transfer coefficient, brought physics based understanding to a field that lacked methodical approaches. He is a world renowned expert in experimental methods in the thermosciences, in experimental measurements in electronics cooling, and in the use of uncertainty analysis as a tool for planning experimental programs of provable accuracy.
Dr. Moffat’s short courses at SEMI-THERM and at many other venues are legendary and have been hugely influential in training generations of engineers on proper experimental characterization and testing of electronic systems. He is a Fellow of both ASME and ISA. He retired from teaching in 1993 but remains active in research, consulting and teaching engineers how to be better engineers.
The THERMI Award
Each year, SEMI-THERM honors a person as a Significant Contributor to the field of semiconductor thermal management. The THERMI award is intended to recognize a recipient’s history of contributions to crucial thermal issues affecting the performance of semiconductor devices and systems.
The voting body of past THERMI winners and current General Chair present the 2017 THERMI award to:
Chandrakant D. Patel
HP Senior Fellow and Chief Engineer, HP Inc
Presentation: “Chips, Data Centers to 3D Printing: An Exciting Road Ahead Paved on the Fundamentals of Thermal Sciences“
Chandrakant Patel is currently Chief Engineer and Senior Fellow of HP Inc.
Patel has led HP Labs in delivering innovations in chips, systems, data centers, storage, networking, print engines and software platforms. He is a pioneer in thermal and energy management in data centers, and in the application of information technology for available energy management at the scale of cities.
Patel is an ASME and an IEEE Fellow, and has been granted 148 patents and published more than 150 papers. An advocate of a return to fundamentals, he has served as an adjunct faculty member in engineering at Chabot College, U.C. Berkeley Extension, San Jose State University and Santa Clara University.
In 2014, Chandrakant was elected to the Silicon Valley Engineering Hall of Fame.
The 2016 Harvey Rosten Award
Subtractive Design: A Novel Approach to Heatsink Improvement
Robin Bornoff, John Wilson, John Parry
Mentor Graphics, Mechanical Analysis
Robin Bornoff attained a Mechanical Engineering Degree from Brunel University in 1992 followed by a PhD in 1995 for CFD research. He then joined Mentor Graphics Corporation, Mechanical Analysis Division (formerly Flomerics Ltd) as an application and support engineer, specializing in the application of CFD to electronics cooling and the design of the built environment. Having been the Product Marketing Manager responsible for the FloTHERM and FloVENT products, he is now Market Development Manager for the Physical Design of Electronics in the Mechanical Analysis Division.
John Wilson joined Mentor Graphics Corporation, Mechanical Analysis Division in 1999, after receiving his BS and MS in Mechanical Engineering from the University of Colorado at Denver. Previously John managed the engineering design services business, ranging from IC component level to Data Centers, heat sink optimization and compact model development. John has extensive experience in IC package level test and analysis correlation through his work at Mentor Graphics’ Fremont based Thermal Test Facility. He is currently the Electronics Product Specialist, for the Mechanical Analysis Division.
John Parry attained a Chemical Engineering Degree from Leeds University in 1982, and a PhD in 1988. He joined Mentor Graphics Corporation’s Mechanical Analysis Division, when it was founded as Flomerics in 1989 to manage its customer services operation, and later head its research activities. John has coordinated several collaborative research and knowledge transfer projects, and oversaw the technical integration of MicReD into Flomerics’ business. He has experience in compact modeling of fans, IC & LED packages, heatsinks, DoE & optimization methods, and thermal characterization, with over 75 published technical articles. He is a member of JC15 and past chair of SEMI-THERM and has 4 patents pending.
The Harvey Rosten Award
The award is for outstanding work, recently published or in the public domain, which advances the analysis or modeling of thermal or thermomechanical effects in electronic equipment or components, including experiments aimed specifically at the validation of numerical models.
The award is in the form of a plaque and a $1000 cash prize. The award was established by the family and friends of Harvey Rosten, to commemorate his achievements in the field of thermal analysis of electronics equipment, and the thermal modeling of electronics parts and packages. The Award is made annually to encourage innovation and excellence in these and closely related fields. The recipient is selected by the Selection Committee, made up of eminent practitioners in the electronics-thermal field.
The criteria for selection are:
- The work represents an advance in thermal analysis or thermal modeling of electronics equipment or components, including experiments aimed specifically at validating numerical models.
- The work demonstrates clear application to practical electronics design
- The work demonstrates insight into the physical processes affecting the thermal behavior of electronics components, parts and systems.
- The work is innovative in embodying this understanding in either thermal analysis or thermal modeling.
- A pragmatic approach is taken in the application of the work.
The Harvey Rosten Award is supported by an endowment fund, managed by a Board of Trustees, chaired by Mrs. Esther Rosten.
Past Winners of the Thermi Award
1991 – Robert Moffat, Stanford University (Emeritus)
1993 – Bernie Siegal, Thermal Engineering Associates
1994 – Allan Kraus, Naval Postgraduate School
1995 – Bob Simons, IBM
1996 – Gordon Ellison, Thermal Computations, Inc.
1997 – Avram Bar-Cohen, Univ. of Minnesota (now, U. Maryland)
1998 – Harvey Rosten*, Flomerics
1999 – Richard Chu, IBM
2000 – Kaveh Azar, Lucent Technologies 2001 – Clemens J. M. Lasance, Philips Research Labs
2002 – Al Ortega, University of Arizona
2003 – Micahel M. Yovanovich, University of Waterloo
2004 – Roger R. Schmidt, IBM
2005 – Thomas S. Tarter, Neophotonics
2006 – Wataru Nakayama, ThermTech International
2007 – David L. Blackburn, NIST
2008 – Dereje Agonafer, Dr. Martin Luther King, Jr. Visiting Professor, MIT
2009 – Yogendra Joshi, School of Mechanical Engineering, Georgia Institute of Technology
2010 – Bruce Guenin, Sun Microsystems
2011 – James S. Wilson, Raytheon
2012 – Dr. Bahgat G. Sammakia
2013 – Kenneth E. Goodson, PhD
2014 – Ali Shakouri, PhD
2015 – Christian Belady, General Manager, Data Center Services Microsoft Global Foundation Services
2016 – Dr. Ravi-Mahajan, Intel