Thermal Innovations that Keep the World’s Technology Cool.
SEMI-THERM is an international forum dedicated to the thermal management and characterization of electronic components and systems. It provides knowledge covering all thermal length scales from IC to facility level. The symposium fosters the exchange of knowledge between thermal engineers, professionals and leading experts from industry as well as the exchange of information on the latest academic and industrial advances in electronics thermal management.
The SEMI-THERM Educational Foundation (STEF) is dedicated to worldwide educational opportunities and resources within the electronics thermal engineering community. It is our mission to provide programs for on-going professional development, technical networking, and engagement of academia and industry in pursuit of innovation and excellence.
The organization, and associated symposium, is governed by volunteers from the thermal industry. While some of us participate year after year, we welcome new volunteers eager to become committee chairs/members.
Contacts for Presenters and Exhibitors
Jesse Galloway, Sr. Engineering Director, Amkor – Jesse.Galloway@amkor.com
For information on Technical Program (Abstracts, Manuscripts and Presentations)
Adriana Rangel, Thermal Engineer, Cisco – email@example.com
For information on presenting Short Courses, How-To’s, Product Tear Downs
Denise Rael, Marketing Manager Semi-Therm – drael@Semi-Therm.org
For information on Exhibition Space and Vendor Workshops
Other Committee Contacts
George Meyer, CEO, Celsia Inc – firstname.lastname@example.org
Ross Wilcoxon, Principal ME, Rockwell Collins email@example.com
Bill Maltz, President, Electronics Cooling Solutions – firstname.lastname@example.org
Bernie Siegal, CEO, Thermal Engineering Associates – email@example.com
Bonnie Crystall , CS Communications – firstname.lastname@example.org
Veerendra Mulay, Thermal Engineer, Facebook – email@example.com
Jim Wilson, Engineering Fellow, Raytheon – firstname.lastname@example.org
Tom Tarter, President, Package Science Services LLC email@example.com