Call for Papers: Deadline Submission Contact Adriana Rangel

Contact Adriana Rangel

Symposium Reg
Become an Exhibitor
Call For Papers
Call For Papers
App Dev Challenge



6 x four hour short courses from thermal thought leaders

50+ technical papers & how-to’s from leading companies and universities

Numerous FREE tear down sessions and product workshops for all attendees


40+ companies set up to show off their capabilities

Technical sales engineers who are ready to introduce and demonstrate new technology.

Booth size of 10 x 8 ft. Interact with – and gain – new customers and clients


Over 400 engineers, academicians & industry pundits from 20 countries

150+ companies, consultants and universities represented

FREE admission to all for exhibits, vendor workshops, how-to courses, and products tear downs


“I’ve been involved with SEMI-THERM for over 10 years now. It is one of the best events to connect with colleagues, meet new friends and to learn from industry veterans.”

George Meyer, CEO, Celsia Inc.
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Final Program
App Dev Challenge
Final Program

Total Activity Time

Short Courses – 24 Hours
Technical Presentations – 22 Hours
Exhibits – 10 Hours
Vendor Workshops – 8 Hours
How To’s & Product Tear Downs – 6 Hours
Keynote Address & Lunch Speakers – 3 Hours
Event Details

Who Should Attend

Attendees include anyone interested in thermal design, management and characterization of electronic systems and components. SEMI-THERM provides a forum for engineers, academics, and executives to learn, exchange ideas, and display the latest in thermal management techniques, products and services. Here are some of the topics we’ve covered in past years:

New Technologies

  • Advances in Thermal Components
  • Energy Harvesting Materials
  • Thermal Control Methods
  • 3D & Nano-Technologies

Component & System Design

  • Heat Spreaders, Air Movers, TIMs
  • Design Software & Modeling
  • Processors, ICs, Memory
  • Solid State Technologies

Testing & Validation

  • Characterization & Material Measurement
  • Instrumentation & Controls
  • Reliability Testing
  • JEDEC Standards


  • Portable & Power Electronics
  • Harsh Environments
  • Telecommunications
  • Data Centers

Topic Champions

2.5D and 3D ElectronicsJesse Galloway, Amkor Technology
Additive ManufacturingTom Tarter, Package Science Services
Air Mover Technologies with Low AcousticsDavid Nelson, Nelson Acoustics
Automotive / Aerospace / OutdoorEric Dede, Toyota Research Institute
Computational Fluid Dynamics (CFD)Robin Bornoff and John Parry, Mentor Graphics, a Siemens Business
Concurrent Design/LEDJim Petroski
Consumer ElectronicsBill Maltz, Electronic Cooling Solutions
Mark Carbone, Intel
Data Center CoolingMarcelo del Valle, Intel
Liquid CoolingDave Saums, DS&A LLC
Measurement TechniquesKazuaki Yazawa, Purdue University
Thermal Interface MaterialsJason Strader, Laird Technologies
Two Phase CoolingPablo Hidalgo, Aavid Thermacore
Become an Exhibitor